Product name:AI Server Thermal Pad Offering Excellent Thermal Conductivity And Electrical Insulation For Battery Pack Thermal Management
Recommended Operating Temperature (°C):-40 to 200℃
Hardness:75 Shore 00
Product name:AI Server Thermal Pad Offering Excellent Thermal Conductivity And Electrical Insulation For Battery Pack Thermal Management
Recommended Operating Temperature (°C):-40 to 200℃
Hardness:75 Shore 00
Product name:High Thermal Conductivity 8.0W/MK Low Dielectric Thermally Conductive Gap Filler Pads For Semiconductor Microwave Components
Recommended Operating Temperature (°C):-40 to 200℃
Hardness:85 Shore 00
Products name:2.5W/mK Silicone Thermal Pad EV Thermal Interface Material For Battery Pack Thermal Management
Continuos Use Temp:-40℃ to 200℃
Application:EV Battery Pack
Products name:8.5W/MK High Temperature 0.5mm Custom Silicone Gap Filler Electric Thermal Pads For Gpu Cpu Led
Keywords:Silicone Thermal Pads
Continuos Use Temp:-40℃ to 200℃
Product name:Thermal Gap Filler Designed To Improve Thermal Conductivity And Extend Service Life Of Electronic Components In Long Term
Construction:Ceramic filled silicone elastomer
Breakdown Strength(V/mm):≥5500
Products name:Silicone Thermal Pad With 1.5W/mK Thermal Conductivity Designed For Heat Management In Electronics And AI Service
Keywords:Silicone Thermal Pads
Continuos Use Temp:-40℃ to 200℃
Products name:Thermal Gap Filler Designed To Fill Air Gaps Between Heating Elements And Heat Dissipation Fins For Optimal Performance
Thickness:Available In Varies Thicknes
Keywords:Thermal Gap Filler
Products name:Thermal Gap Filler Designed for Heat Dissipation in LED TV and LED Lit Lamps Replacing Bergquist Sil-PAD900 for CPU Cooling
Thickness:Available In Varies Thicknes
Hardness( Shore 00):75
Products name:Thermal Conductive Silicone Pad 5.0W/MK High-Temperature Insulation Gap Pad GPU Laptop Thermal Gap Filler Pad
Keywords:Thermal Conductive Silicone Pad
Hardness:65/30 Shore 00
Products name:Ultra Soft Naturally Tacky Thermal Gap Filler Blue Silicone Rubber Sheet With 2.0W/mK Thermal Conductivity Designed For Heat Transfer
Thermal conductivity:2.0W/mK
Density:2.9g /cm³
Products name:Thermal Gap Filler Silicone Gap Pad With Electrical Isolation And Naturally Tacky Surface For Thermal Management
Thermal conductivity:2.0W/mK
Density:2.65 g/cm³