Thermal Gap Filler Designed To Fill Air Gaps Between Heating Elements And Heat Dissipation Fins For Optimal Performance

Name: Thermal Gap Filler Designed To Fill Air Gaps Between Heating Elements And Heat Dissipation Fins For Optimal Performance
Brand: Dongguan Ziitek Electronic Materials & Technology Ltd.
SKU: TIF100-16-38UF
Price: 5.03 USD
Availability: InStock

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Thermal Gap Filler Designed To Fill Air Gaps Between Heating Elements And Heat Dissipation Fins For Optimal Performance

Large Image : Thermal Gap Filler Designed To Fill Air Gaps Between Heating Elements And Heat Dissipation Fins For Optimal Performance

Product Details:

Place of Origin:	China
Brand Name:	ZIITEK
Certification:	UL and RoHs
Model Number:	TIF100-16-38UF
Document:	TIF100-16-38UF_Data Sheet.pdf

Payment & Shipping Terms:

Minimum Order Quantity:	1000pcs
Price:	Negotiation
Packaging Details:	1000pcs/bag
Delivery Time:	3-5work days
Payment Terms:	T/T
Supply Ability:	10000/day

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Thermal Gap Filler Designed To Fill Air Gaps Between Heating Elements And Heat Dissipation Fins For Optimal Performance

Description

Products Name:	Thermal Gap Filler Designed To Fill Air Gaps Between Heating Elements And Heat Dissipation Fins For Optimal Performance	Thickness:	Available In Varies Thicknes
Keywords:	Thermal Gap Filler	Hardness:	75 Shore 00
Construction:	Ceramic Filled Silicone Elastomer	Density:	2.1 G/cm³
Application:	To Fill Air Gaps Between Heating Elements And Heat Dissipation Fins For Optimal Performance	Thermal Conductivity:	1.6W/mK
Highlight:	GPU Thermal Gap Filler , CPU Thermal Gap Filler , 3mm Thermal Gap Filler

Thermal Gap Filler Designed To Fill Air Gaps Between Heating Elements And Heat Dissipation Fins For Optimal Performance

The TIF^®100-16-38UF is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.

Features:

> Good thermal conductive: 1.6 W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating

> RoHS compliant
> UL recognized

Applications:

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions

> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules

Typical Properties of TIF^®100-16-38UF Series
Property	Value		Test method
Color	Deep red		Visual
Construction	Ceramic filled silicone elastomer		******
Density(g/cm³)	2.1		ASTM D792
Thickness Range(inch/mm)	0.010~0.020	0.030~0.200	ASTM D374
	0.25~0.50	0.75~5.00
Hardness(Shore 00)	75	75	ASTM 2240
Recommend Operating Temperature(℃)	-40 to 200℃		******
Breakdown Voltage(V/mm)	≥ 5500		ASTM D149
Dielectric Constant @1Mhz	5.5		ASTM D150
Volume Resistivity (Ohm-meter)	≥1.0X10¹²		ASTM D257
Thermal Conductivity (W/m-K)	1.6		ASTM D5470
	1.6		ISO22007
Fire rating	V-0		UL 94 (E331100)

Product Specifications

Standard Thickness: 0.010" (0.25 mm)～ 0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm).

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF^® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Company Profile

Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.

Thermal Gap Filler Designed To Fill Air Gaps Between Heating Elements And Heat Dissipation Fins For Optimal Performance 0

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

Tag:

Contact Person: Dana Dai

Tel: +86 18153789196

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Thermal Gap Filler Designed To Fill Air Gaps Between Heating Elements And Heat Dissipation Fins For Optimal Performance

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