Color:Gray
Breakdown Voltage (V/mm):≥5500 VAC
Specific Gravity:3.3 g/cm³
Products name:High Thermal Conductivity 16W/mK Thermal Conductive Pad Silicone Material For GPU CPU Heatsink AI Servers Cooling Applications
Application:GPU CPU Heatsink AI Servers Cooling Applications
Thickness:0.75~5.0mm
Product name:Premium Performance Thermal Pad Ideal Gap Filler For AI Processors AI Servers
Construction & Compostion:Ceramic filled silicone elastomer
Dielectric Constant @1MHz:4.5
Product name:Eco-Friendly Thermal Interface Material Highly Compressible Thermal Interface Thermal Pad For Dissipate Heat of LED Display Power Supply
Construction & Compostion:Ceramic filled silicone elastomer
Dielectric Constant @1MHz:6.0
Product name:Electric Thermal Silicone Gap Filling Cooling Pad Thermal Absorbing Conductive Insulating Pad
Dielectric Constant @1MHz:4.5
Sample:Sample free
Product name:Premium Performance Dark Gray Thermal Pad 4.0W/MK For Network Communication Products
Application:Network Communication Products
Keywords:Thermal pad
Products name:Thermal Conductive Pad Featuring Balanced Softness And 3W Thermal Conductivity For Heat Transfer And Component Protection
Thickness:Available In Varies Thicknes
Thermal conductivity:3.0W/m-K
Prodcuts name:Thermal Conductive Pad Silicone Based Soft Compressible Electrically Isolating Moldable For Complex Parts And Low Stress Applications
Fire rating:UL 94 V-0
Thermal conductivity:1.5W/m-K
Products name:Thermal Conductive Pad for Heat Dissipation in Electronic Devices Ensuring Thermal Management and Enhanced Performance
Continuos Use Temp:-40℃ to 200℃
Density:2.1g/cm³
Products name:Thermal Interface Material 3.0W Thermal Silicone Pad For New Energy Vehicle Batteries PCB
Continuos Use Temp:-45℃ to 200℃
Hardness:27±5 Shore 00
Product name:Electric Insulation Thermal Pad Thermally Conductive Silicon Protective Cushioning Material
Keywords:Electric Insulation Thermal Pad
Application:CPU, Display card ,heat sink
Product name:Application In Electronic Parts High Thermal Conductivity 3.0W/MK Thermal Conductive Silicone Pad For AI Servers Thermal Management
Density(g/cm³):3.0
Thermal conductivity:3 W/m-K