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Highest Thermal Gap Filler , Thermal Conductive Pad For Electronics Heat Transfer

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

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Highest Thermal Gap Filler , Thermal Conductive Pad For Electronics Heat Transfer

Highest Thermal Gap Filler , Thermal Conductive Pad For Electronics Heat Transfer
Highest Thermal Gap Filler , Thermal Conductive Pad For Electronics Heat Transfer
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Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF7120
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
Detailed Product Description
Thermal Conductivity& Compostion: 13 W/m-K Specific Gravity: 2.85 G/cc
Heat Capacity: 1 L /g-K Color: Gray
Continuos Use Temp: -50 To 200℃ Hardness: 45 Shore 00
Applications: Electronics Usage: Heat Transfer
High Light:

high temperature phase change materials

,

thermal conductivity silicone

 

Highest Thermal Gap Filler , Thermal Conductive Pad For Electronics Heat Transfer
 
  The TIF7120 
   
   use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
 
Features:
 

Available in varies thicknesses 13 W/mK
Broad range of hardnesses available
Moldability for complex parts
Outstanding thermal performance
High tack surface reduces contact resistance

 
Applications:
 

Memory Modules
Mass storage devices
Automotive electronics
Set top boxes
Audio and video components
IT infrastructure
GPS navigation and other portable devices
CD-Rom, DVD-Rom cooling
LED Power Supply

 

Typical Properties of TIF™7120
Color

gray

VisualComposite ThicknesshermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
***10mils / 0.254 mm0.21
20mils / 0.508 mm0.27
Specific Gravity
2.85 g /ccASTM D297

30mils / 0.762 mm

0.39

40mils / 1.016 mm

0.43
Heat Capacity
1 l /g-KASTM C351

50mils / 1.270 mm

0.50

60mils / 1.524 mm

0.58

Hardness
45 Shore 00ASTM 2240

70mils / 1.778 mm

0.65

80mils / 2.032 mm

0.76
Tensile Strength

55 psi

ASTM D412

90mils / 2.286 mm

0.85

100mils / 2.540 mm

0.94
Continuos Use Temp
-50 to 200℃

***

110mils / 2.794 mm

1.00 

120mils / 3.048 mm

1.07 
Dielectric Breakdown Voltage
>5500 VACASTM D149

130mils / 3.302mm

1.16

140mils / 3.556 mm

1.25
Dielectric Constant
4.5 MHzASTM D150

150mils / 3.810 mm

1.31

160mils / 4.064 mm

1.38
Volume Resistivity
5.6X1012Ohm-meterASTM D257

170mils / 4.318 mm

1.43

180mils / 4.572 mm

1.50
Fire rating
94 V-0

equivalent UL

190mils / 4.826 mm

1.60

200mils / 5.080 mm

1.72
Thermal conductivity
13 W/m-KASTM D5470Visua l/ ASTM D751ASTM D5470

 

 
Standard Thicknesses:        
  0.120" (3.05mm) 
Consult the factory alternate thickness.

Standard Sheets Sizes:    
     
8" x 16"(203mm x 406mm)   16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied. 

Peressure Sensitive Adhesive:   
                 
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:   
           
TIF™ series sheets type can add with fiberglass reinforced.
Highest Thermal Gap Filler , Thermal Conductive Pad For Electronics Heat Transfer 0
 

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer
6.Quality assurance contract
 

Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana

Tel: +8618153789196

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