Highest Thermal Gap Filler Thermal Conductive Pad For Electronics Heat Transfer

Highest Thermal Gap Filler Thermal Conductive Pad For Electronics Heat Transfer

The TIF800QE series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat sinks or metal baseplates. It ofers excellent compliance, allowing it to conform tightly to heat sources with varying shapes and height differences. Even in confined or irregular spaces,it maintains stable thermal conductivity,enabling efficient heat transfer from discrete components or the entire PCB to the metal housing or heat sink.This significantly improves the heat dissipation eficiency of electronic lcomponents, thereby enhancing operational stability and extending device lifespan.

Features:

> Good thermal conductive: 13.0W/mK
> Naturally tacky needing no further adhesive coating
> High compliance adapts to various pressure application environments
> Available in different thickness options

Applications:

> Heat dissipation structure for radiators
> Telecommunication equipment
> Automotive electronics
> Battery packs for electric vehicles
> LED drivers and lamps

> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board