Highest Thermal Gap Filler Thermal Conductive Pad For Electronics Heat Transfer

Name: Highest Thermal Gap Filler Thermal Conductive Pad For Electronics Heat Transfer
Brand: Dongguan Ziitek Electronical Material and Technology Co., Ltd
SKU: TIF860QE
Price: 5.03 USD
Availability: InStock

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Highest Thermal Gap Filler Thermal Conductive Pad For Electronics Heat Transfer

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Product Details:

Place of Origin:	China
Brand Name:	ZIITEK
Certification:	UL and RoHs
Model Number:	TIF860QE
Document:	TIF800QE_Data Sheet.pdf

Payment & Shipping Terms:

Minimum Order Quantity:	1000pcs
Price:	Negotiation
Packaging Details:	1000pcs/bag
Delivery Time:	3-7 work days
Payment Terms:	T/T
Supply Ability:	10000/day

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Highest Thermal Gap Filler Thermal Conductive Pad For Electronics Heat Transfer

Description

Products Name:	Highest Thermal Gap Filler Thermal Conductive Pad For Electronics Heat Transfer	Thermal Conductivity& Compostion:	13.0W/m-K
Density（g/cm³）:	3.45	Dielectric Constant @1MHz:	7.0
Color:	Gray	Recommended Operating Temperature (℃):	-40 To 200℃
Thickness:	1.5mmT	Applications:	Electronics
Usage:	Electronics Heat Transfer	Keywords:	Thermal Conductive Pad
Highlight:	high temperature phase change materials , thermal conductivity silicone , Highest Thermal Gap Filler

Highest Thermal Gap Filler Thermal Conductive Pad For Electronics Heat Transfer

Product Overview

The TIF^®800QE series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat sinks or metal baseplates. It offers excellent compliance, allowing it to conform tightly to heat sources with varying shapes and height differences. Even in confined or irregular spaces, it maintains stable thermal conductivity, enabling efficient heat transfer from discrete components or the entire PCB to the metal housing or heat sink. This significantly improves the heat dissipation efficiency of electronic components, thereby enhancing operational stability and extending device lifespan.

Key Features

Good thermal conductivity: 13.0W/mK
Naturally tacky needing no further adhesive coating
High compliance adapts to various pressure application environments
Available in different thickness options

Applications

Heat dissipation structure for radiators
Telecommunication equipment
Automotive electronics
Battery packs for electric vehicles
LED drivers and lamps
Handheld portable electronics
Semiconductor automated test equipment (ATE)
CPU
Display card
Mainboard/mother board

Technical Specifications of TIF^®️800QE Series

Property	Value	Test Method
Color	Gray	Visual
Construction	Ceramic filled silicone elastomer	ZKTM J024
Density (g/cm³)	3.45	ASTM D792
Thickness Range (inch/mm)	0.012~0.020 \| 0.030~0.200 0.30~0.50 \| 0.75~5.00	ASTM D374
Hardness (Shore 00)	40 \| 35	ASTM 2240
Recommended Operating Temperature	-40 to 200℃	ZKTM J025
Breakdown Strength (V/mm)	≥5500	ASTM D149
Dielectric Constant @1MHz	7.0	ASTM D150
Volume Resistivity (Ohm-meter)	＞1.0×10¹²	ASTM D257
Flame rating	V-0	UL 94 (E331100)
Thermal conductivity (W/m-K)	13.0	ASTM D5470

Product Dimensions

Standard Thickness: 0.012" (0.30 mm) ~ 0.200" (5.00mm)
Standard Size: 16" × 16" (406mm × 406mm)

The TIF^® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

Manufacturer Profile

Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). We have rich experiences in this field which can support you with the latest, most effective and one-step thermal management solutions. We have many advanced production equipment, full test equipment and fully automatic coating production lines which can support the production of high performance thermal silicone pad, thermal graphite sheet/film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

Certifications

ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL

Frequently Asked Questions

Q: What is a Thermal Interface Material (TIM)?

A: TIM (Thermal Interface Material) refers to a class of materials used to fill microscopic air gaps between a heat source and a heat sink. TIMs help reduce interface thermal resistance and improve heat transfer from the heat source to the cooling structure. Common TIMs include thermal pads, thermal gels, thermal greases, phase change materials (PCMs), and liquid metal.

Q: What is Thermal Conductivity?

A: Thermal conductivity indicates a material's ability to conduct heat and is typically measured in W/m*K. Under the same testing conditions, a higher thermal conductivity generally indicates better heat-conduction capability.

Q: What is Thermal Resistance?

A: Thermal resistance indicates the resistance to heat flow through a material or interface and is typically expressed in K/W or °C/W. Lower thermal resistance generally means that heat can pass through the material more efficiently.

Q: What is the difference between Thermal Conductivity and Thermal Resistance?

A: Thermal conductivity primarily reflects the intrinsic heat-conduction capability of a material, while thermal resistance is also affected by factors such as thermal conductivity, material thickness, contact area, and interface conditions. In practical applications, it is important to consider not only thermal conductivity but also the overall thermal resistance of the TIM layer.

Overall Rating

5.0

Based on 50 reviews for this supplier

Rating Snapshot

The following is the distribution of all ratings

5 stars

100%

4 stars

3 stars

2 stars

1 stars

All Reviews

Dante

Poland Jul 20.2026

Helpful (6)

These worked so well, I came back for more. I have a mini pc with passive cooling. When it heats up, the case/heat sink separates slightly from the CPU causing the CPU temps to increase drastically. These thermal pads filled the gap giving me consistent CPU temperatures. I also used them for LAN and NVME drives.

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