Products name:IGBT Thermal Conductive Pad Silicone Material With Naturally Tacky Surface Eliminating Need For Additional Adhesive Coating
Density:2.5g/cm³
Feature:Soft and compressible for low stress applications
Thermal conductivity& Compostion:2.8 W/m-K
Specific Gravity:2.41 g/cc
Feature:silicone thermal gap pad
Products description:Ultra Soft 2.0W/mK High Compression Thermal Pad For Battery Pack Thermal Management
Thickness:3mmT
Feature:Ultra soft and High Compression
Products name:Yellow 2.0W/mK Thermal Gap Filler Pad Thermal Insulators Materials For Various Electronics
Thickness:2.5mmT
Materials:Ceramic filed silicone elastomer
thickness:4mmT
Compliance:UL
Materials:6 W/mK thermal gap filler
thickness:3mmT
Compliance:RoHS
Materials:6.2W/mK thermal gap filler
thickness:2.5mmT
PRODUCT NAME:thermal gap filler pads
application:LED-lit BLU in LCD
Products name:Highest Thermal Gap Filler Thermal Conductive Pad For Electronics Heat Transfer
Thermal conductivity& Compostion:13.0W/m-K
Density(g/cm³):3.45
HARDNESS:45SHORE00
thickness:0.5mmT
Brand:Ziitek
thickness:0.25mmT
Brand:Ziitek
PRODUCT NAME:TIF110FG-15E
Color:PINK
thickness:0.5mmT
Brand:Ziitek
Color:PINK
thickness:0.25mmT
PRODUCT NAME:TIF110FG-14E