China Thermal Gap Filler

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  Deep Red Thermal Interface Material For Telecommunication Hardware

  Thickness:Available In Varies Thicknes

  Construction & Compostion:Ceramic filled silicone rubber

  Hardness:60 Shore 00

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  Pink Semiconductor Automated Test Equipment Thermal Gap Filler Silicone Pad 3.0W/MK

  Prodcuts name:Pink Semiconductor Automated Test Equipment Thermal Gap Filler Silicone Pad 3.0W/MK

  Thermal conductivity:3.0W/m-K

  Densisy:3.0g/cm³

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  Telecommunication Hardware 3.0W/M-K Thermal Gap Fillers Materials With High Thermal Conductivity

  Products name:Telecommunication Hardware 3.0W/M-K Thermal Gap Fillers Materials With High Thermal Conductivity

  Thickness:Available In Varies Thicknes

  Thermal conductivity:3.0W/m-K

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  gray Silicone Rubber 1.0 W/MK Thermal Gap Filler For Automotive Engine Control Units

  Thermal conductivity& Compostion:1.0 W/m-K

  Specific Gravity:2.01 g/cc

  Heat Capacity:1 l /g-K

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  Black Thermal Conductivity Silicone Materials Thermal Gap Filler Pad 1.5 W/M-K For Micro Heat Pipe Thermal Solutions

  Products name:Black Thermal Conductivity Silicone Materials Thermal Gap Filler Pad 1.5 W/M-K For Micro Heat Pipe Thermal Solutions

  Thermal conductivity& Compostion:1.5 W/m-K

  Density:2.1 g/cm³

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  Ultra Thin Blue Silicone Thermal Pad 1.5W/mK 55 Shore 00 Thermal Gap Filler for LED Lighting

  Prodcuts name:Ultra Thin Blue Silicone Thermal Pad 1.5W/mK 55 Shore 00 Thermal Gap Filler for LED Lighting

  Thermal conductivity:1.5W/m-K

  Breakdown Voltage:≥5500 VAC

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  6.2 W/M-K Deep Red​ Thermal Gap Filler For Handheld Portable Electronics

  Thermal conductivity& Compostion:6.2 W/m-K

  Specific Gravity:2.85 g/cc

  Heat Capacity:1 l /g-K

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  High Speed Mass Storage Drives Thermally Gap Filler 2.0 W/M-K Light Green

  Thermal conductivity& Compostion:2.0 W/m-K

  Specific Gravity:2.85 g/cc

  Heat Capacity:1 l /g-K

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  Light Blue 4.0 W/M-K Thermal Gap Filler For Micro Heat Pipe Thermal Solutions

  Thermal conductivity& Compostion:4.0 W/m-K

  Specific Gravity:2.85 g/cc

  Heat Capacity:1 l /g-K

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  Thermal Gap Filler Heat Conductivity Materials For Cooling Components, 1.5 W/M-K

  Thermal conductivity& Compostion:1.5 W/m-K

  Specific Gravity:2.85 g/cc

  Heat Capacity:1 l /g-K

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  Gray Heat Sinking Housing Thermal Gap Filler Available in varies thickness, 1.5W/mK

  Thermal conductivity& Compostion:2.0 W/m-K

  Specific Gravity:2.85 g/cc

  Heat Capacity:1 l /g-K

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  Silicone Thermal Pad With 1.5W/mK Thermal Conductivity Designed For Heat Management In Electronics And AI Service

  Products name:Silicone Thermal Pad With 1.5W/mK Thermal Conductivity Designed For Heat Management In Electronics And AI Service

  Keywords:Silicone Thermal Pads

  Continuos Use Temp:-40℃ to 200℃

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