Ultra Soft 2.0W/mK High Compression Thermal Pad For Battery Pack Thermal Management

Name: Ultra Soft 2.0W/mK High Compression Thermal Pad For Battery Pack Thermal Management
Brand: Dongguan Ziitek Electronical Material and Technology Co., Ltd
SKU: TIF4120
Price: 5.03 USD
Availability: InStock

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Ultra Soft 2.0W/mK High Compression Thermal Pad For Battery Pack Thermal Management

Large Image : Ultra Soft 2.0W/mK High Compression Thermal Pad For Battery Pack Thermal Management

Product Details:

Place of Origin:	China
Brand Name:	ZIITEK
Certification:	RoHs
Model Number:	TIF4120
Document:	TIF400_Data Sheet.pdf

Payment & Shipping Terms:

Minimum Order Quantity:	1000pcs
Price:	Negotiation
Packaging Details:	1000pcs/bag
Delivery Time:	3-5work days
Payment Terms:	T/T
Supply Ability:	10000/day

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Ultra Soft 2.0W/mK High Compression Thermal Pad For Battery Pack Thermal Management

Description

Products Description:	Ultra Soft 2.0W/mK High Compression Thermal Pad For Battery Pack Thermal Management	Thickness:	3mmT
Feature:	Ultra Soft And High Compression	Application:	Battery Pack Thermal Management
Keywords:	High Compression Thermal Pad	Thermal Conductivity:	2.0W/mK
Density(g/cm³）:	2.5
Highlight:	thermally conductive filler , thermal conductivity silicone , Thermal Gap Filler Ultra Soft

Ultra Soft 2.0W/mK High Compression Thermal Pad For Battery Pack Thermal Management

TIF^®400 Series Overview

TIF ®400 Series is a well-balanced, general-purpose thermal pad offering good thermal conductivity and moderate hardness. This balanced design provides excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components.

Key Features

3mm thickness
Good thermal conductivity
Moldability for complex parts
Soft and compressible for low stress applications
Naturally tacky - no additional adhesive coating required
High tack surface reduces contact resistance

Applications

Display card
Mainboard/mother board
Notebook
Power supply
AI server
Medical equipment
Unmanned aerial vehicle (UAV)
Robot
Wireless Charger

Technical Specifications of TIF^®400 Series

Property	Value	Test Method
Color	Yellow	Visual
Construction	Ceramic filled silicone elastomer	-
Thickness range (inch/mm)	0.010"~0.020" (0.25~0.50mm) \| 0.030"~0.200" (0.75~5.00mm)	ASTM D374
Hardness (Shore 00)	65 \| 45	ASTM 2240
Density (g/cm³)	2.5	ASTM D792
Recommended Operating Temperature (℃)	-40-200℃	-
Breakdown Strength (V/mm)	≥5500	ASTM D149
Dielectric Constant @1MHz	5.0	ASTM D150
Volume Resistivity (Ohm-cm)	＞1.0×10¹²	ASTM D257
Thermal conductivity (W/m-K)	2.0	ASTM D5470 / ISO22007
Flame Rating	V-0	UL94 (E331100)

Product Specifications

Standard Thickness: 0.010" (0.25 mm) – 0.200" (5.00 mm) with increments of 0.010" (0.25 mm)

Standard Size: 16"×16" (406 mm×406 mm)

Component Codes

Reinforcement Fabric: FG (Fiberglass)

Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)

Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

Our Services

Online Service: 12 hours, inquiry reply within fastest response time

Working Time: 8:00am - 5:30pm, Monday to Saturday (UTC+8)

Well-trained & experienced staff available to answer all inquiries in English

Standard Export Carton or marked with customer's information or customized packaging

Free samples available

After-Service

Even though our products undergo strict inspection, if you find any parts not working properly, please provide proof and we will help resolve the issue with a satisfactory solution.

Frequently Asked Questions

Q: What is a Thermal Silicone Pad?

A: A thermal silicone pad is a pre-formed thermal interface material typically made of a silicone-based material and thermally conductive fillers. It is designed to fill gaps between heat sources and heat sinks. Depending on the product formulation, thermal silicone pads can also provide electrical insulation.

Q: What are the advantages of Thermal Silicone Pads?

A: Key advantages include easy installation, controlled thickness, good flexibility, and effective gap-filling capability. Depending on the application, thermal silicone pads can also be designed with different levels of thermal conductivity, hardness, flame resistance, and electrical insulation.

Q: Is a thinner Thermal Silicone Pad always better?

A: Not necessarily. If the pad is too thin to adequately fill the actual gap, proper interface contact may not be achieved. The appropriate thickness should be selected based on the actual structural tolerances and application requirements.

Q: What are the common thicknesses of Thermal Silicone Pads?

A: Different product series can be available in thicknesses ranging from very thin pads to several millimeters or even thicker options. The appropriate thickness should be determined based on the customer's gap, compression requirements, and assembly structure.

Q: Can Thermal Silicone Pads be customized in size?

A: Yes. Thermal silicone pads can be customized according to the customer's product structure, including length, width, thickness, and complex shapes. Die-cutting, punching, and other processing methods can also be used to produce customized parts.

Overall Rating

5.0

Based on 50 reviews for this supplier

Rating Snapshot

The following is the distribution of all ratings

5 stars

100%

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2 stars

1 stars

All Reviews

Dante

Poland Jul 20.2026

Helpful (6)

These worked so well, I came back for more. I have a mini pc with passive cooling. When it heats up, the case/heat sink separates slightly from the CPU causing the CPU temps to increase drastically. These thermal pads filled the gap giving me consistent CPU temperatures. I also used them for LAN and NVME drives.

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