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No Need Preheating Pink Thermal Phase Change Interface Material For Notebook 0.95 W/mK
Cache Chips gray 2.5 W/mK No heat sink preheating required phase changing materials The TIC™808A is low melting point thermal interface material. At 50℃, The TIC™800A Series begins to soften and flow, filling ... Read More
CPU Gray 2.5w Phase Changing materials High Thermal of T-PCM585 Thermally pad The TIC™800A Series is low melting point thermal interface material. At 50℃, The TIC™800A Series begins to soften and flow, filling ... Read More
Pink Low Resistance Thermal phase chaging materials Interface Pad For Computer Serves 0.95 W/MK The TIC™803P Series is low melting point thermal interface material. At 50℃, The TIC™800P Series begins to soften ... Read More
Gray -25℃ - 125℃ Thermal Interface Material Phase Change for High Power LED Lights TIC™805G series is low melting point thermal interface material. At 50℃, TIC™800G series begins to soften and flow, filling the ... Read More
IGBTs Phase Change Material Heat Sink 0.024℃-in² / W With Low Thermal Resistance The TIC™800Y Series is low melting point thermal interface material. At 50℃, The TIC™800Y Series begins to soften and flow, ... Read More
CPU Gray Insulated Phase ChangingThermal Conductivity Materials PCM 2.5W/mK T-PCM T725 T558 HI-flow PCS Kenflow The TIC™800A Series is low melting point thermal interface material. At 50℃, The TIC™800A Series ... Read More
Thermal Phase Changing Low Melting Materials , Heat Sensitive Materials For Notebook TIC™812G series is low melting point thermal interface material. At 50℃, TIC™800G series begins to soften and flow, filling ... Read More
Low Melting Point Thermal Phase Changing Materials 0.95 W / mK with 0.024℃-in² / W The TIC™803Y Series is low melting point thermal interface material. At 50℃, The TIC™800Y Series begins to soften and flow, ... Read More
High Frequency Microprocessors Thermal Interface Pad Low Resistance -25℃ - 125℃ The TIC™800P Series is low melting point thermal interface material. At 50℃, The TIC™800P Series begins to soften and flow, ... Read More
Cache Chips gray 2.5 W/mK No heat sink preheating required phase changing materials The TIC™808A is low melting point thermal interface material. At 50℃, The TIC™808A Series begins to soften and flow, filling ... Read More