0.95W/mK YELLOW Thermal Phase Changing Materials TIC™805Y with 0.024℃-in² / W

0.95W/mK YELLOW Thermal Phase Changing Materials TIC™805Y with 0.024℃-in² / W

    The TIC™805Y Series is low melting point thermal interface material. At 50℃, The TIC™805Y Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™805Y Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.

    The TIC™805Y Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.
 

Features

>0.024℃-in² /W thermal resistance
>Naturally tacky at room temperature, no adhesive required
>No heat sink preheating required
 

Applications

Standard Thicknesses:

0.003"(0.076mm) 0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm)
Consult the factory alternate thickness.

 

Standard Sizes:

9" x 18"(228mm x 457mm) 9" x 400'(228mm x 121M)
TIC™800 series are supplied with a white release paper and a bottom liner. TIC™800 series is available in kiss cut an extended pull tab liner or individual die cut shapes.

Peressure Sensitive Adhesive:

Peressure Sensitive Adhesive is not applicable for TIC™800 series products.

Reinforcement:

No reinforcement is necessary.