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Product Details:
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| Name: | High Thermal Conductive Metal Phase Changing Materials For Microprocessors Chipsets | Color: | Silvery White |
|---|---|---|---|
| Thermal Conductivity: | 18.9W/mK | Composition: | Alloy |
| Temperature Range: | -40℃~250℃ | Density: | 8.0g/cm³ |
| Keywords: | Phase Changing Materials | Construction & Composition: | Bismuth Alloy |
| Name: | High Thermal Conductive Metal Phase Changing Materials For Microprocessors Chipsets | Color: | Silvery White |
| Thermal Conductivity: | 18.9W/mK | Composition: | Alloy |
| Temperature Range: | -40℃~250℃ | Density: | 8.0g/cm³ |
| Keywords: | Phase Changing Materials | Construction & Composition: | Bismuth Alloy |
| Name: | High Thermal Conductive Metal Phase Changing Materials For Microprocessors Chipsets | Color: | Silvery White |
| Thermal Conductivity: | 18.9W/mK | Composition: | Alloy |
| Temperature Range: | -40℃~250℃ | Density: | 8.0g/cm³ |
| Keywords: | Phase Changing Materials | Construction & Composition: | Bismuth Alloy |
| Name: | High Thermal Conductive Metal Phase Changing Materials For Microprocessors Chipsets | Color: | Silvery White |
| Thermal Conductivity: | 18.9W/mK | Temperature Range: | -40℃~250℃ |
| Density: | 8.0g/cm³ | Keywords: | Phase Changing Materials |
| Construction & Composition: | Bismuth Alloy | ||
| Highlight: | Microprocessors Chipsets Metal Phase Changing Materials,Microprocessors Chipsets Phase Changing Materials,High Thermal Conductive Phase Changing Materials |
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High Thermal Conductive Metal Phase Changing Materials For Microprocessors Chipsets
| Typical Properties of TIC®800M Series | ||
| Property | Value | Test Method |
| Color | Silvery white | Visual |
| Form | Flaky solid | Visual |
| Construction & Composition | Bismuth Alloy | **** |
| Density (g/cm³) | 8.0 | ASTM D792 |
| Thermal conductivity(W/mK) | 18.9 | ISO22007 |
| Specific heat capacity(J/g℃) | 0.24 | ASTM E1269 |
| Resistivity (Ω-m) | <10-4 | ASTM D257 |
| Continuous Use Temp(℃) | -40 to 250℃ | ***** |
| Phase Change Temperature Range(℃) | >60 | ASTM D3418 |
| Solidification Range(℃) | <57 | ASTM D3418 |
Packaing:
TIC®800M can be packaged according to customer requirements.
Usage Instructions:
After using this material, it is recommended to use suitable foam or gaskets to enclose the edges of the phase change metal,
ensuring that the material does not disperse or spread.
For more information about thermal conductive materials, please contact our company.
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Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Independent R&D team
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Contact Person: Dana Dai
Tel: 18153789196