Low-Melting Laptop CPU Thermal Pad PCM Phase Change Material For Gap Filling

The TIC^®800G Series is a thermally conductive phase change material (PCM) engineered for high reliability and high thermal conductivity. Solid at room temperature for easy handling and installation, the material softens into a semi-fluid state once it reaches its specific phase transition temperature. In this state, it fully fills the microscopic gaps between the heat-generating interface and the heat sink, significantly reducing contact thermal resistance and achieving excellent heat transfer efficiency. This material is ideal for solving heat dissipation challenges in medium- and high-power-density electronic devices under both transient and steady-state operation.

• High thermal conductivity
• Soft surface for optimal interface conformity
• Low thermal resistance
• Self-adhesive — no additional adhesive required

• Power conversion equipment
• Power supplies and vehicle storage batteries
• Large communication switch hardware
• LED TVs and lighting
• Laptop computers
• Smartphone main chips
• Audio-visual products
• Load processors

• 0.004" (0.10 mm)
• 0.005" (0.13 mm)
• 0.006" (0.15 mm)
• 0.008" (0.20 mm)
• 0.010" (0.25 mm)
• 0.012" (0.30 mm)

11.811" * 19.685" (300 mm * 500 mm)

The TIC® series can be die-cut into different shapes. If you require different thicknesses or specifications, or would like to learn more about thermal conductive materials, please contact our company.

Ziitek Electronic Material and Technology Ltd was founded in 2006 and is headquartered in Dongguan, Guangdong. It is a high-tech enterprise specializing in heat conduction, heating, sealing, and EMI products. To quickly respond to global customer demand, the company has established production bases in Kunshan (Jiangsu), Taiwan Province, and Vietnam, and continues to promote the global distribution of production areas to ensure efficient delivery and localized services.

Ziitek's product system covers thermal interface materials, EMI shielding, heating products, foamed silicone seals, and thermal engineering plastics, and is widely used in new energy vehicles, energy storage, AI servers, 5G communications, aerospace, and other fields. The company has passed numerous certifications including IATF16949 and ISO9001, and its products meet ROHS, REACH, and UL specifications, serving the global market with reliable quality.