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No Need Preheating Pink Thermal Phase Change Interface Material For Notebook 0.95 W/mK
Low Melting Point Thermal Phase Changing Materials 0.95 W / mK with 0.024℃-in² / W The TIC™803Y Series is low melting point thermal interface material. At 50℃, The TIC™800Y Series begins to soften and flow, ... Read More
High Frequency Microprocessors Thermal Interface Pad Low Resistance -25℃ - 125℃ The TIC™800P Series is low melting point thermal interface material. At 50℃, The TIC™800P Series begins to soften and flow, ... Read More
IGBTs Phase Change Material Heat Sink 0.024℃-in² / W With Low Thermal Resistance Ziitek provide thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, ... Read More
CPU Gray Insulated Phase ChangingThermal Conductivity Materials PCM 2.5W/mK T-PCM T725 T558 HI-flow PCS Kenflow The TIC™800A Series is low melting point thermal interface material. At 50℃, The TIC™800A Series ... Read More
Thermal Phase Changing Low Melting Materials , Heat Sensitive Materials For Notebook TIC™812G series is low melting point thermal interface material. At 50℃, TIC™800G series begins to soften and flow, filling ... Read More