Phase change material CPU cooling
TIC™810P series is low melting point thermal interface material.At 50℃, TIC™800P series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.
TIC™810P series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.
TIC™810P series shows no thermal performance degradation after 1,000 hours@130℃,or after 500cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.
TIC800P-Series-Datasheet.pdf
Features
> Highly compliant surfacecharacteristic with highthermal conductivity.
> High thermal conductive andHigh dielectric strength.
> Low thermal resistance with high voltage isolation
> Resistant to tears and punctures.
Applications
| High Frequency Microprocessors |
| Notebook |
| Computer Serves |
| Memory Modules |
| Cache Chips |
| IGBTs |
| COB Led |
| Desktop PCs |
| CPU |
| Microprocessors |
| Chipsets |
| Graphic Processing Chips |
| Custom application |
| Servers |
| Memory Modules |
| Power semiconductors |
| Power conversion modules |
| LED Power Supply |
| LED Controller |
| LED Lights |
| LED Ceilinglamp |
| Monitoring the Power Box |
| AD-DC Power Adapters |
| Typical Properties of TIC™800P series |
| Product Name |
TIC™805P |
TIC™806P |
TIC™810P |
Test Method |
| Color |
Pink |
Visual |
| Thickness |
0.005"/0.126mm |
0.008"/0.203mm |
0.010"/0.245mm |
****** |
| Thickness Tolerance |
±0.0008"/±0.0019mm |
±0.0008"/±0.0019mm |
±0.0012"/±0.030mm |
****** |
| Specific Gravity |
2.2 g/cc |
Helium Pycnometer |
| Temperature range |
-25 to 125℃ |
****** |
| Phase Change Softening Temperature |
50℃-60℃ |
****** |
| Thermal conductivity |
0.95W/mK |
ASTM D5470 |
| Thermal Impedance@50psi |
0.24℃-in²/W 0.15℃-cm²W |
0.053℃-in²/W 0.34℃-cm²W |
0.080℃-in²/W 0.52℃-cm²W |
ASTM D5470 |
Standard Thicknesses:
0.005"(0.127mm) ,0.008"(0.203mm), 0.010"(0.254mm)
Please contact us for confirming of the alternate thickness.
Standard Sizes :
10" x 16"(254mm x 406mm) , 16*400"(406mm*121.92M)
TIC™800P series are supplied with a white release paper and a bottom liner.
TIC™800P series is available in kiss cut an extended pull tab liner or individual die cut shapes.
Peressure Sensitive Adhesive:
Peressure Sensitive Adhesive is not applicable for TIC™800P series products.
Reinforcement:
No reinforcement is necessary.
Packaging Details & Lead time
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Factory profile
Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge
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