5.0W/Mk High Reliability Pcm Phase Change Material For CPU And GPU

The TIC^®800G Series is a high-reliability, high-thermal-conductivity phase change material (PCM) engineered for demanding thermal management in CPUs, GPUs, and other high-power-density electronic devices. Solid at room temperature for easy handling and installation, the material softens into a semi-fluid state once it reaches its phase transition temperature, fully filling microscopic gaps between the heat-generating interface and the heat sink. This significantly reduces contact thermal resistance and delivers excellent heat transfer efficiency under both transient and steady-state operation.

• High thermal conductivity of 5.0 W/m·K
• Soft surface for optimal interface conformity
• Low thermal resistance
• Self-adhesive — no additional adhesive required

• Smartphone main chips
• Audio-visual products
• Load processors
• High-frequency microprocessors
• Notebook and desktop PCs
• Computer servers
• Memory modules
• Cache chips
• IGBTs

Standard Thickness: 0.004" (0.10 mm), 0.005" (0.13 mm), 0.006" (0.15 mm), 0.008" (0.20 mm), 0.010" (0.25 mm), 0.012" (0.30 mm)

Standard Size: 11.811" × 19.685" (300 mm × 500 mm)

Pressure-sensitive Adhesive: Not applicable to TIC® series products.

The TIC® series can be die-cut into different shapes. If you require different thicknesses and specifications, or would like to learn more about our thermal conductive materials, please contact our company.