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Product Details:
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| Product Name: | Low Thermal Resistance 8.5W/mK Phase Change Material TIM For Power Conversion Equipment | Application: | Power Conversion Equipment |
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| Thermal Conductivity: | 8.5W/mK | Phase Change Softening Temperature(℃): | 50~60℃ |
| Density: | 2.7g/cm³ | Recommend Operating Temperature: | -40~125℃ |
| Keywords: | Phase Change Material | Color: | Gray |
| Highlight: | 8.5W/mK phase change material,low thermal resistance TIM,phase change material for power conversion |
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TIC®800R Series is an ultra-high thermal conductivity phase change material featuring a unique grain orientation structure. Through a micro-ordered arrangement, this structure achieves directional optimization of the heat flow path, significantly doubling macroscopic thermal conductivity efficiency.
When the temperature exceeds the phase transition point of 50°C, the material softens and infiltrates the interface, filling micro-irregular gaps and ultimately forming a heat conduction channel with extremely low thermal resistance at the contact surface — improving the efficiency of the heat dissipation system.
| Product Name | TIC®808R | TIC®810R | TIC®812R | Testing Standards |
|---|---|---|---|---|
| Color | Gray | Visual | ||
| Thickness (inch / mm) | 0.008" / 0.20 mm | 0.010" / 0.25 mm | 0.012" / 0.30 mm | ASTM D374 |
| Density (g/cm³) | 2.7 | ASTM D792 | ||
| Recommended Operating Temperature (°C) | -40 ~ 125 | ZKTM J025 | ||
| Phase Change Softening Temperature (°C) | 50 ~ 60 | ZKTM J052 | ||
| Thermal Conductivity | 8.5 W/m·K | ASTM D5470 ISO 22007 |
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| Thermal Impedance (°C-in²/W) @ 50 psi | 0.013 | 0.014 | 0.015 | ASTM D5470 |
| Flame Rating | V-0 | Equivalent to UL94 | ||
Standard Thickness
0.008" (0.20 mm), 0.010" (0.25 mm), 0.012" (0.30 mm)
Standard Size
15.748" × 6.299" (400 mm × 160 mm)
TIC® series can be molded into different shapes to meet your requirements. If you need different thicknesses or would like to learn more about thermal conductive materials, please contact our company.
Ziitek is a high-tech enterprise dedicated to the R&D, manufacture, and sales of thermal interface materials (TIMs). We have rich experience in this field and can support you with the latest, most effective, one-step thermal management solutions.
We operate many advanced production machines, full test equipment, and fully automatic coating production lines capable of producing high-performance thermal silicone pads, thermal graphite sheets and films, thermal double-sided tapes, thermal insulation pads, thermal ceramic pads, phase change materials, thermal grease, and more. Our products are UL94 V-0, SGS, and RoHS compliant.
Q: What is a Phase Change Thermal Interface Material?
A: A phase change material (PCM) undergoes a physical phase transition when it reaches a specific temperature. This phase change helps improve the interface contact between the heat source and heat sink, enhancing heat transfer performance.
Q: What are the main advantages of PCM?
A: PCM can soften or undergo a phase transition within a specific temperature range, allowing it to conform more closely to the mating surfaces, improve interface contact, and reduce interface thermal resistance.
Q: What applications are suitable for PCM?
A: PCM is commonly used in CPUs, GPUs, power electronics, telecommunications equipment, and other applications requiring low interface thermal resistance and reliable thermal transfer.
Q: What is the difference between PCM and Thermal Silicone Pads?
A: Thermal pads generally maintain a relatively stable solid form during operation, while PCM is designed to soften or undergo a phase transition at a specific temperature, allowing it to conform more closely to the heat source and heat sink surfaces.
Contact Person: Dana Dai
Tel: +86 18153789196