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Pink Color Thermal Heat Conductivity Materials Silicone Laptop Gap Filler Pad

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

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Pink Color Thermal Heat Conductivity Materials Silicone Laptop Gap Filler Pad

Pink Color Thermal Heat Conductivity Materials Silicone Laptop Gap Filler Pad
Pink Color Thermal Heat Conductivity Materials Silicone Laptop Gap Filler Pad
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Large Image :  Pink Color Thermal Heat Conductivity Materials Silicone Laptop Gap Filler Pad

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF110FG-14E
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
Detailed Product Description
Color: PINK Thickness: 0.25mmT
PRODUCT NAME: TIF110FG-14E Keyword: Thermal Conductive Silicone Laptop Gap Filler Pad
Application: Heat Sinks
High Light:

thermally conductive filler

,

high temperature phase change materials

,

Silicone Laptop Gap Filler Pad

 

Pink Color Thermal Heat Conductivity Materials Silicone Laptop Gap Filler Pad

 

The TIF110FG-14E  thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

 


Features:

 

> Self absorption

> Excellent thermal conductive: 1.5 W/mK

> Thickness: 0.25 mmT
> Soft and Compressible for low stress applications
> Available in varies sizes

 

Applications:

 

> Handheld portable electronics

> Automotive engine control units

> High speed mass storage drives
> RDRAM memory modules
> Telecommunication hardware

> LED TV and LED-lit lamps

> Micro heat pipe thermal solutions

> Heat Sinking Housing at LED-lit BLU in LCD

 

Typical Properties of TIF 110FG-14E
Color

pink

Visual Composite Thickness  hermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
*** 10mils / 0.254 mm

0.55

20mils / 0.508 mm

0.82

Specific Gravity

2.87 g/cc

ASTM D297

30mils / 0.762 mm

1.01

40mils / 1.016 mm

1.11

Heat Capacity

1 l/g-K

ASTM C351

50mils / 1.270 mm

1.27

60mils / 1.524 mm

1.45

Hardness
35
(Shore 00)
ASTM 2240

70mils / 1.778 mm

1.61

80mils / 2.032 mm

1.77 

Tensile Strength 

40 psi

ASTM D412

90mils / 2.286 mm

1.91 

100mils / 2.540 mm

2.05

Continuos Use Temp
-50 to 200℃

***

110mils / 2.794 mm

2.16   

120mils / 3.048 mm

2.29   

Dielectric Breakdown Voltage
>1500~>5500 VAC ASTM D149

130mils / 3.302mm

2.44

140mils / 3.556 mm

2.56

Dielectric Constant
5.5 MHz ASTM D150

150mils / 3.810 mm

2.67

160mils / 4.064 mm

2.77

Volume Resistivity
4.0X10"
Ohm-meter
ASTM D257

170mils / 4.318 mm

2.89

180mils / 4.572 mm

2.98

Fire rating
94 V0

equivalent UL

190mils / 4.826 mm

3.05 

200mils / 5.080 mm

3.14

Thermal conductivity
1.5 W/m-K ASTM D5470 Visua l/ ASTM D751 ASTM D5470
 

Peressure Sensitive Adhesive:   
                 
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.
 
Standard Thicknesses:           
0.010" (0.25mm)
Consult the factory alternate thickness.

Standard Sheets Sizes:    
     
8" x 16"(203mm x 406mm)  
TIF™ series Individual die cut shapes can be supplied. 
 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

Reinforcement:   
           
TIF™ series sheets type can add with fiberglass reinforced.
Pink Color Thermal Heat Conductivity Materials Silicone Laptop Gap Filler Pad 0
 

Company Profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Miss. Dana

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)