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Product Details:
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| Products Name: | IGBT Thermal Conductive Pad Silicone Material With Naturally Tacky Surface Eliminating Need For Additional Adhesive Coating | Density: | 2.5g/cm³ |
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| Feature: | Soft And Compressible For Low Stress Applications | Thickness: | 0.25mmT |
| Appilcation: | IGBTs | Color: | Yellow |
| Keywords: | IGBT Thermal Conductive Pad | Thermal Conductivity: | 2.0W/mK |
| Highlight: | thermally conductive filler,high temperature phase change materials,thermal gap filler for IGBTs |
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The TIF®410FG thermally conductive interface materials are designed to fill air gaps between heating elements and heat dissipation fins or metal bases. Their flexibility and elasticity make them ideal for coating uneven surfaces, effectively transferring heat to metal housings or dissipation plates from individual components or entire PCBs. This enhances the efficiency and lifespan of heat-generating electronic components.
| Property | Value | Test Method |
|---|---|---|
| Color | Yellow | Visual |
| Construction | Ceramic filled silicone elastomer | - |
| Thickness range (inch/mm) | 0.010"~0.020" (0.25~0.50mm) | 0.030"~0.200" (0.75~5.00mm) | ASTM D374 |
| Hardness (Shore 00) | 65 | 45 | ASTM 2240 |
| Density (g/cm³) | 2.5 | ASTM D792 |
| Recommended Operating Temperature (℃) | -40-200℃ | - |
| Breakdown Strength (V/mm) | ≥5500 | ASTM D149 |
| Dielectric Constant @1MHz | 5.0 | ASTM D150 |
| Volume Resistivity (Ohm-cm) | >1.0×10¹² | ASTM D257 |
| Thermal conductivity (W/m-K) | 2.0 | ASTM D5470 / ISO22007 |
| Flame Rating | V-0 | UL94 (E331100) |
Standard Thickness: 0.010" (0.25 mm) – 0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"×16" (406 mm×406 mm)
Component Codes:
The TIF series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.
Contact Person: Dana Dai
Tel: +86 18153789196
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