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thermal gap filler pad TIF300 Grey

导热硅胶片
January 30, 2021
Category Connection: Thermal Gap Filler
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Tags:
#thermally conductive filler #thermal conductivity silicone #high temperature phase change materials
Brief: Get an inside view of the Grey 2.5 W/mK Compressible Conductive Heatsink Thermal Gap Filler with Adhesive Backing. This video showcases its features, applications, and how it enhances thermal management in electronic components.
Related Product Features:
  • Good thermal conductivity of 2.5 W/mK for efficient heat dissipation.
  • Naturally tacky surface eliminates the need for additional adhesive coating.
  • Soft and compressible design reduces stress on electronic components.
  • Available in various thicknesses to suit different application needs.
  • Suitable for high-speed mass storage drives and LED lighting systems.
  • Ideal for automotive engine control units and telecommunication hardware.
  • Fire-rated 94 V0 for enhanced safety in electronic applications.
  • Customizable with pressure-sensitive adhesive on one or both sides.
Faqs:
  • How do I request customized samples?
    You can leave a message on our website, send an email, or call us directly to request samples.
  • What's the thermal conductivity test method used?
    The thermal conductivity is tested using Hot Disk and ASTM D5470 methods to ensure accurate data.
  • How to choose the right thermal conductivity for my application?
    The choice depends on the power source wattage and heat dissipation requirements. Share your application details for a tailored recommendation.
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