TIF040AB-12S

thermal gel
December 30, 2024
Category Connection: Thermal Conductive Gel
Brief: Discover the Ziitek TIF040AB-12S, a 4.0W/mK Heat Sink Silicone Thermal Conductive Putty designed for efficient heat dissipation in electronic devices. This two-component, high-performance putty ensures optimal thermal management, enhancing the longevity of heat-generating components. Ideal for notebooks, set-top boxes, and more.
Related Product Features:
  • High thermal conductivity of 4.0W/mK for efficient heat dissipation.
  • UL recognized for safety and reliability.
  • Naturally tacky, eliminating the need for additional adhesives.
  • Two-part formulation ensures easy storage and handling.
  • High durability for long-term performance.
  • Optimized shear thinning characteristics for easy dispensing.
  • Suitable for a wide temperature range from -45°C to 200°C.
  • Flame rating of 94V0 for enhanced safety in electronic applications.
Faqs:
  • Are you a trading company or manufacturer?
    We are a manufacturer based in China with over 18 years of experience in thermal interface materials.
  • How can I request customized samples?
    You can leave a message on our website, send us an email, or call us directly to request samples.
  • What test methods are used to measure thermal conductivity?
    The thermal conductivity is tested using Hot Disk and ASTM D5470 methods, ensuring accurate and reliable data.
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