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Black soft thermal pads TIF100-01

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January 30, 2021
Category Connection: Thermal Conductive Pad
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Tags:
#thermal conductive material #thermally conductive pad #cpu thermal pad
Brief: Discover the Black Thermal Conductive Gap Filler Pad TIF100-01, an ultra-soft silicone pad designed for GPU thermal management solutions. With excellent thermal conductivity of 1.5 W/mK, this pad is perfect for low-stress applications in electronics, automotive, and telecommunications.
Related Product Features:
  • Good thermal conductivity at 1.5 W/mK for efficient heat dissipation.
  • Naturally tacky surface eliminates the need for additional adhesives.
  • Soft and compressible design reduces stress on delicate components.
  • Available in various thicknesses from 0.5mm to 5.0mm for versatile applications.
  • Broad range of hardness options to suit different thermal management needs.
  • Moldable for complex parts, ensuring precise fit and performance.
  • Outstanding thermal performance in temperatures ranging from -40°C to 160°C.
  • UL 94 V0 fire-rated for enhanced safety in electronic applications.
Faqs:
  • What is the thermal conductivity of the TIF100-01 thermal pad?
    The TIF100-01 thermal pad offers a thermal conductivity of 1.5 W/mK, ensuring efficient heat transfer for optimal thermal management.
  • Can the thermal pad be used in high-temperature environments?
    Yes, the TIF100-01 thermal pad operates effectively in temperatures ranging from -40°C to 160°C, making it suitable for various demanding applications.
  • Is the thermal pad electrically isolating?
    Yes, the TIF100-01 thermal pad is electrically isolating, providing safe thermal management without the risk of electrical conductivity.
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