Yellow 2.0W/mK Thermal Gap Filler Pad Thermal Insulators Materials For Various Electronics

The TIF^®4100 Series is a well-balanced, general-purpose thermal pad offering good thermal conductivity and moderate hardness. This balanced design provides excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components.

• 2.5mm thickness
• Good thermal conductivity (2.0W/mK)
• Good softness and fillability
• Self-adhesive without need for additional surface adhesives
• Good insulation performance

• Various electronics
• LED TV and LED-lit lamps
• High speed mass storage drives
• RDRAM memory modules
• LED lighting
• Micro heat pipe thermal solutions
• Automotive engine control units
• Telecommunication hardware

Standard Thickness: 0.010" (0.25 mm) – 0.200" (5.00 mm) with increments of 0.010" (0.25 mm).

Standard Size: 16"×16" (406 mm×406 mm).

Reinforcement Fabric: FG (Fiberglass)

Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)

Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

• Our value message: "Do it right the First time, total quality control"
• Core competencies in thermal conductive interface materials
• Competitive advantage products
• Confidentiality agreement and Business Secret Contract
• Free sample offer
• Quality assurance contract

A thermal silicone pad is a pre-formed TIM typically made of a silicone-based material and thermally conductive fillers. It is designed to fill gaps between heat sources and heat sinks. Depending on the product formulation, thermal silicone pads can also provide electrical insulation.

Key advantages include easy installation, controlled thickness, good flexibility, and effective gap-filling capability. Depending on the application, thermal silicone pads can also be designed with different levels of thermal conductivity, hardness, flame resistance, and electrical insulation.

Not necessarily. If the pad is too thin to adequately fill the actual gap, proper interface contact may not be achieved. The appropriate thickness should be selected based on the actual structural tolerances and application requirements.

Different product series can be available in thicknesses ranging from very thin pads to several millimeters or even thicker options. The appropriate thickness should be determined based on the customer's gap, compression requirements, and assembly structure.

Yes. Thermal silicone pads can be customized according to the customer's product structure, including length, width, thickness, and complex shapes. Die-cutting, punching, and other processing methods can also be used to produce customized parts.

Some thermal silicone pads can be supplied with single-sided or double-sided adhesive backing. The adhesive is mainly used to assist with material positioning and installation. The appropriate adhesive should be selected according to the operating temperature and application environment.

The optimal compression range varies depending on the material. It should be determined based on the pad's hardness, thickness, and product structure. A single fixed compression ratio should not be applied to all thermal pad applications.