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Thermal Conductive Pad Featuring Balanced Softness And 3W Thermal Conductivity For Heat Transfer And Component Protection

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China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
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The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

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I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

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Thermal Conductive Pad Featuring Balanced Softness And 3W Thermal Conductivity For Heat Transfer And Component Protection

Thermal Conductive Pad Featuring Balanced Softness And 3W Thermal Conductivity For Heat Transfer And Component Protection
Thermal Conductive Pad Featuring Balanced Softness And 3W Thermal Conductivity For Heat Transfer And Component Protection
Thermal Conductive Pad Featuring Balanced Softness And 3W Thermal Conductivity For Heat Transfer And Component Protection Thermal Conductive Pad Featuring Balanced Softness And 3W Thermal Conductivity For Heat Transfer And Component Protection Thermal Conductive Pad Featuring Balanced Softness And 3W Thermal Conductivity For Heat Transfer And Component Protection

Large Image :  Thermal Conductive Pad Featuring Balanced Softness And 3W Thermal Conductivity For Heat Transfer And Component Protection

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF100-30-11ES
Document: TIF100-30-11ES_Data Sheet.pdf
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: Negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Payment Terms: T/T
Supply Ability: 10000/day
Contact Now

Thermal Conductive Pad Featuring Balanced Softness And 3W Thermal Conductivity For Heat Transfer And Component Protection

Description
Products Name: Thermal Conductive Pad Featuring Balanced Softness And 3W Thermal Conductivity For Heat Transfer And Component Protection Thickness: Available In Varies Thicknes
Thermal Conductivity: 3.0W/m-K Construction & Compostion: Ceramic Filled Silicone Elastomer
Application: For Heat Transfer Specific Gravity: 3.15 G/cm³
Hardness: 12 Shore 00 Breakdown Voltage(V/mm): ≥5500
Keywords: Thermal Conductive Pad

Thermal Conductive Pad Featuring Balanced Softness And 3W Thermal Conductivity
The TIF®100-30-11ES Series is a thermal pad specifically designed to tackle high-level cooling challenges in environments sensitive to extreme mechanical stress. It combines high thermal conductivity with near-fluid softness, ensuring perfect filling of the contact interface even under ultra-low mounting pressure, completely eliminating air thermal resistance, and providing superior thermal solutions and physical protection for the most precise and high heat flux electronic components.
Key Features
  • High thermal conductivity
  • Extremely soft with low compression stress to protect sensitive components
  • Self-adhesive without the need for additional surface adhesives
  • Good insulation performance
Applications
  • Power tools
  • Network communication products
  • Electric vehicle batteries
  • Computer CPU/GPU Cooling
  • New energy vehicle power systems
  • Heat pipe thermal solutions
  • Memory Modules
  • Mass storage devices
  • Automotive electronics
  • Set top boxes
Typical Properties of TIF®100-30-11ES Series
Property Value Test Method
Color Dark Gray Visual
Construction & Composition Ceramic filled silicone elastomer ******
Density (g/cm³) 3.15 ASTM D792
Thickness Range (inch/mm) 0.020~0.030 (0.50~0.75) | 0.040~0.200 (1.00~5.00) ASTM D374
Hardness (Shore 00) 12 ASTM 2240
Continuous Use Temp -40 to 200℃ ***
Breakdown Voltage (V/mm) ≥5500 ASTM D149
Dielectric Constant @1MHz 7.0 ASTM D150
Volume Resistivity ＞1.0×10¹² Ohm-meter ASTM D257
Thermal Conductivity (W/m-K) 3.0 ASTM D5470 / ISO22007
Fire rating V-0 UL 94 (E331100)
Product Specifications

Standard Thickness: 0.020" (0.50 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)

Standard Size: 16"×16" (406 mm×406 mm)

Component Codes

Reinforcement Fabric: FG (Fiberglass)

Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)

Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

TIF® 100-30-11ES Thermal Conductive Pad product image
Our Services
  • Online-service: 12 hours, Inquiry reply within fastest
  • Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8)
  • Well-trained & experienced staff to answer all inquiries in English
  • Standard Export Carton or marked with customer's information or customized
  • Provide free samples
  • After-service: Comprehensive support and satisfactory solutions for any product issues
Frequently Asked Questions
Q: Are you trading company or manufacturer?
A: We are manufacturer in China.
Q: How do I place an order?
A:
  1. Click the "Sent messages" button to continue with the process
  2. Fill out the message form by entering a subject line and message to us
  3. Include any questions you might have about the products as well as your purchase requests
  4. Click the "Send" button when you are finished to complete the process
  5. We will reply you as soon as possible with Email or online
Q: How do I request customized samples?
A: To request samples, you can leave us message on website, or just contact us by send email or call us.

Tag:

thermal conductive material,

thermally conductive pad,

cpu thermal pad

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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