Good Thermal Conductivity Electrically Conductive Silicone Pad For EMI Shielding & Grounding For Gaps Of Chassis Cover Plates

The TIS^®300 Series is a nickel/graphite-filled conductive silicone sheet developed for thermal management and electromagnetic interference (EMI) suppression in 3C electronic products, high-frequency signal equipment, and precision electromagnetic components. It delivers excellent thermal conductivity and surface resistivity, together with high compressibility and soft elasticity, making it suitable for low-pressure mounting conditions. This material series resists galvanic corrosion and maintains its stability under harsh environmental conditions.

• High thermal conductivity
• Surface resistivity (Ohm-cm): < 1.0×10³
• Good corrosion resistance
• High compressibility, soft yet elastic, suitable for low-stress applications

• EMI shielding & grounding for gaps of chassis cover plates
• Grounding for power battery module housings
• Sealing & shielding for enclosures of RRU, switches and blade servers
• Industrial-control equipment cavities
• Sealing for test shielding boxes
• Grounding & shielding for cavity covers of on-board power supplies

Standard Thickness: 0.016" (0.40 mm) ~ 0.200" (5.00 mm)

Standard Size:

• For thickness ≤ 3.00 mm: dimension 16" × 16" (406 mm × 406 mm)
• For thickness > 3.00 mm: dimension 10" × 13" (254 mm × 326 mm)

The TIS® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solutions and manufacturing superior thermal interface materials for the competitive market. Our vast experience allows us to assist our customers best in the thermal engineering field. We serve customers with customized products, full product lines, and flexible production, which makes us the best and most reliable partner for you. Let's make your design more perfect!