China Thermal Conductive Pad

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  High Performance Hardness 35 Shore OO Thermal Pad For 5G Aerospace AI AIoT AR/VR/MR/XR

  Prodcuts name:High Performance Hardness 35 Shore OO Thermal Pad For 5G Aerospace AI AIoT AR/VR/MR/XR

  Construction & Compostion:Ceramic filled silicone elastomer

  Color:Purple

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  Good Insulation Thermally Conductive Silicon Thermal Pad 1.0 W/MK Heat Resistant Thermal Gap Pad

  Prodcuts name:Good Insulation Thermally Conductive Silicon Thermal Pad 1.0 W/MK Heat Resistant Thermal Gap Pad

  Color:Pink/ Blue

  Application:5G, Aerospace, AI, Energy Storage, Industrial, Lighting Equipment

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  Ultra Soft And Good Compressibility Thermally Conductive Gap Filler Pads For 5G Aerospace AI

  Prodcuts name:Ultra Soft And Good Compressibility Thermally Conductive Gap Filler Pads For 5G Aerospace AI

  Application:5G Aerospace AI

  Thickness:0.25mm~5.0mm(0.010"~0.200")

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  Silicone Based Ultra Soft Thermal GAP PAD Materials For AI Processors AI Servers

  Prodcuts name:Silicone Based Ultra Soft Thermal GAP PAD Materials For AI Processors AI Servers

  Thermal conductivity:5.0W/m-K

  Keywords:Thermal GAP PAD Materials

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  Low Thermal Impedance 5.0W Ultra Soft Thermal Pad For Cloud Computing And Servers

  Prodcuts name:Low Thermal Impedance 5.0W Ultra Soft Thermal Pad For Cloud Computing And Servers

  Keywords:Ultra Soft Thermal Pad

  Flame Rating:UL 94 V-0

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  Thermal Conductivity Of 3.0W/Mk Ultra Soft Thermal Pad for 5G Aerospace AI AIoT And Automotive

  Prodcuts name:Thermal Conductivity Of 3.0W/Mk Ultra Soft Thermal Pad For 5G Aerospace AI AIoT And Automotive

  Flame Rating:UL 94 V-0

  Hardness:30 Shore 00

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  Low Bleed Thermal Pad Thermal GAP PAD Materials For AI Processors AI Servers

  Prodcuts name:Low Bleed Thermal Pad Thermal GAP PAD Materials For AI Processors AI Servers

  Hardness:55 Shore 00

  Thermal conductivity:2.8 W/m-K

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  High Performance 10.0W Thermal GAP PAD Materials For Al Servers

  Product name:High Performance 10.0W Thermal GAP PAD Materials For Al Servers

  Keywords:Thermal GAP PAD Materials

  Color:Gray

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  High Performance Silicone-Based Thermally Gap Pad Filler For AI Processors AI Servers

  Prodcuts name:High Performance Silicone-Based Thermally Gap Pad Filler For AI Processors AI Servers

  Continuos Use Temp:-40 to 200℃

  Dielectric Breakdown Voltage:>5500VAC

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  Soft Thermal Pad Electrically Insulating Pad With Exceptional Thermal Conductivity For AI Processors AI Servers

  Products name:Soft Thermal Pad Electrically Insulating Pad With Exceptional Thermal Conductivity For AI Processors AI Servers

  Keywords:Soft thermal pads

  Thickness:0.25mm~5.0mm

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  High Compliance 1.5W Thermally Conductive Gap Filler Pads For AI Processors AI Servers Heat Dissipation

  Products name:High Compliance 1.5W Thermally Conductive Gap Filler Pads For AI Processors AI Servers Heat Dissipation

  Construction:Ceramic filled silicone elastomer

  Thickness:0.25mm~5.0mm

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  7.5W Heat Transfer Thermal Silicone Gel Pads For AI Servers AI Processors

  Products name:7.5W Heat Transfer Thermal Silicone Gel Pads For AI Servers AI Processors

  Thickness:0.50mm~5.0mm

  Thermal conductivity:7.5W/m-K

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