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2W/MK Premium Soft Silicone Thermal Pad For Advanced Cooling Needs

Certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
Customer Reviews
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

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2W/MK Premium Soft Silicone Thermal Pad For Advanced Cooling Needs

2W/MK Premium Soft Silicone Thermal Pad For Advanced Cooling Needs
2W/MK Premium Soft Silicone Thermal Pad For Advanced Cooling Needs 2W/MK Premium Soft Silicone Thermal Pad For Advanced Cooling Needs 2W/MK Premium Soft Silicone Thermal Pad For Advanced Cooling Needs

Large Image :  2W/MK Premium Soft Silicone Thermal Pad For Advanced Cooling Needs

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF100-20-05S
Document: TIF100-20-05S_Data Sheet.pdf
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: Negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Payment Terms: T/T
Supply Ability: 10000/day

2W/MK Premium Soft Silicone Thermal Pad For Advanced Cooling Needs

Description
Products Name: 2W/MK Premium Soft Silicone Thermal Pad For Advanced Cooling Needs Thickness: 2mmT
Thermal Conductivity: 2.0W/m-K Hardness: 65/45 Shore00
Density: 2.65g/cm³ Keywords: Thermal Pad
Application: Cooling Conmponents Sample: Sample Available
Highlight:

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thermal conductive material

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2W/MK Premium Soft Silicone Thermal Pad for Advanced Cooling Needs


The TIF®100-20-05S is an extremely soft gap filling material rated at a thermal conductivity of 2.0W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. Ziitek  TIF®100-20-05S is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface. Protective liners are supplied on both sides allowing for ease of use.


Features


>  Good thermal conductive: 2.0W/mK 
>  Naturally tacky needing no further adhesive coating 
>  Soft and Compressible for low stress applications
>  Available in varies thickness

>  RoHS And UL compliant


Applications


> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components


Typical Properties of TIF®100-20-05S Series
Property Value Test method
Color

Blue

Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 2.65 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
0.25~0.50 0.75~5.00
Hardness(Shore 00) 65 45 ASTM 2240
Recommended Operating Temperature (℃) -40 to 200 ***
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant @1Mhz 4.7 ASTM D150
Volume Resistivity(Ohm-cm) >1.0X1012  ASTM D257
Thermal Conductivity (W/m-K) 2.0 ASTM D5470
2.0 ISO22007
Fire rating V-0 UL 94 (E331100)

 

Product Specifications


Standard Thickness:0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X 16" (406 mmX406 mm)


Component Codes:


Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.


2W/MK Premium Soft Silicone Thermal Pad For Advanced Cooling Needs 0
Packaging Details & Lead time


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated


Company profile


Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.


Our services


Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples


After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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