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Thermal Conductive Pad Silicone Thermal Interface Material For In LED Lit Lamps And Electronic Heat Sinking Applications

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Thermal Conductive Pad Silicone Thermal Interface Material For In LED Lit Lamps And Electronic Heat Sinking Applications

Thermal Conductive Pad Silicone Thermal Interface Material For In LED Lit Lamps And Electronic Heat Sinking Applications
Thermal Conductive Pad Silicone Thermal Interface Material For In LED Lit Lamps And Electronic Heat Sinking Applications
Thermal Conductive Pad Silicone Thermal Interface Material For In LED Lit Lamps And Electronic Heat Sinking Applications Thermal Conductive Pad Silicone Thermal Interface Material For In LED Lit Lamps And Electronic Heat Sinking Applications Thermal Conductive Pad Silicone Thermal Interface Material For In LED Lit Lamps And Electronic Heat Sinking Applications Thermal Conductive Pad Silicone Thermal Interface Material For In LED Lit Lamps And Electronic Heat Sinking Applications Thermal Conductive Pad Silicone Thermal Interface Material For In LED Lit Lamps And Electronic Heat Sinking Applications

Large Image :  Thermal Conductive Pad Silicone Thermal Interface Material For In LED Lit Lamps And Electronic Heat Sinking Applications

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF800 Series
Document: TIF800_Data Sheet.pdf
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: Negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5 work days
Payment Terms: T/T
Supply Ability: 100000pcs/day
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Thermal Conductive Pad Silicone Thermal Interface Material For In LED Lit Lamps And Electronic Heat Sinking Applications

Description
Products Name: Thermal Conductive Pad Silicone Thermal Interface Material For In LED Lit Lamps And Electronic Heat Sinking Applications Color: Gray
Thermal Conductivity: 5.0 W/m-K Hardness: 65/45 Shore 00
Density: 3.35g/cm³ Recommended Operating Temperature (℃): -40 To 200℃
Keywords: Thermal Conductive Pad Application: In LED Lit Lamps And Electronic Heat Sinking Applications
Breakdown Voltage (V/mm): ≥5500
Highlight:

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5.0W/mK thermal silicone pad

Thermal Conductive Pad Silicone Thermal Interface Material
Designed for LED lighting systems and electronic heat sinking applications, the TIF®800 Series provides optimal thermal management solutions for various industrial and electronic applications.
Company Overview
Ziitek is a high-tech enterprise specializing in the research, development, manufacturing, and sales of thermal interface materials (TIMs). With extensive experience and advanced production equipment, we provide comprehensive thermal management solutions including thermal silicone pads, thermal graphite sheets, phase change materials, and more. All products comply with UL94 V-0, SGS, and ROHS standards.
Product Overview
The TIF®800 Series is a well-balanced, general-purpose thermal pad offering excellent thermal conductivity and moderate hardness. This balanced design provides superior surface conformity and ease of use, effectively transferring heat while providing basic physical protection for electronic components. Ideal for medium to high power heat dissipation needs with optimal cost-performance balance.
Key Features
  • High thermal conductivity: 5.0W/mK
  • Excellent softness and fillability
  • Self-adhesive - no additional surface adhesives required
  • Superior insulation performance
Applications
  • Power tools
  • Network communication products
  • Electric vehicle batteries
  • Computer CPU/GPU cooling
  • New energy vehicle power systems
  • Cooling components to chassis or frame
  • High-speed mass storage drives
  • Heat sinking housing at LED-lit BLU in LCD displays
Technical Specifications of TIF®800 Series
Property Value Test Method
Color Gray Visual
Construction & Composition Ceramic filled silicone elastomer ******
Density (g/cm³) 3.35 ASTM D792
Thickness Range (inch/mm) 0.010~0.020 | 0.030~0.200
0.25~0.50 | 0.75~5.00		 ASTM D374
Hardness (Shore 00) 65 | 45 ASTM 2240
Recommended Operating Temperature (℃) -40 to 200 ******
Breakdown Voltage (V/mm) ≥5500 ASTM D149
Dielectric Constant @ 1MHz 6.0 ASTM D150
Volume Resistivity (Ohm-meter) ＞1.0×10¹² ASTM D257
Flame Rating V-0 UL 94 (E331100)
Thermal Conductivity 5.0W/m-K ASTM D5470
ISO22007
Product Specifications
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"×16" (406 mm×406 mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass)
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)
The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.
Thermal Conductive Pad Product Image
Ziitek Culture
Quality: Do it right the first time, total quality control
Effectiveness: Work precisely and thoroughly for effectiveness
Service: Quick response, on-time delivery and excellent service
Team Work: Complete teamwork including sales, marketing, engineering, R&D, manufacturing, and logistics teams - all dedicated to providing satisfactory service for customers

Tag:

thermal conductive material,

thermally conductive pad,

cpu thermal pad

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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