Flexible Thermal Conductive Pad With High Stickiness Surface For Enhanced Heat Dissipation In PCB CPU And LED Applications

Name: Flexible Thermal Conductive Pad With High Stickiness Surface For Enhanced Heat Dissipation In PCB CPU And LED Applications
Brand: Dongguan Ziitek Electronic Materials & Technology Ltd.
SKU: TIF100-20-16E
Price: 5.10 USD
Availability: InStock

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Flexible Thermal Conductive Pad With High Stickiness Surface For Enhanced Heat Dissipation In PCB CPU And LED Applications

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Product Details:

Place of Origin:	Dongguan
Brand Name:	Ziitek
Certification:	RoHs UL
Model Number:	TIF100-20-16E
Document:	TIF100-20-16E_Data Sheet.pdf

Payment & Shipping Terms:

Minimum Order Quantity:	1000
Price:	Negotiation
Packaging Details:	1000pcs/Bag
Delivery Time:	3-7 work day
Payment Terms:	T/T
Supply Ability:	10000PCS/days

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Flexible Thermal Conductive Pad With High Stickiness Surface For Enhanced Heat Dissipation In PCB CPU And LED Applications

Description

Products Name:	Flexible Thermal Conductive Pad With High Stickiness Surface For Enhanced Heat Dissipation In PCB CPU And LED Applications	Keywords:	Thermal Conductive Pad
Recommended Operating Temperature (℃):	-40 To 200℃	Breakdown Voltage(V/mm):	≥5500
Thermal Conductivity:	2.0W/mK	Sample:	Free Sample
Density(g/cm³）:	2.7	Application:	For Enhanced Heat Dissipation In PCB CPU And LED Applications
Highlight:	thermal conductive material , thermally conductive pad , thermal conductive pad violet

Flexible Thermal Conductive Pad With High Stickiness Surface For Enhanced Heat Dissipation In PCB CPU And LED Applications

Company profile

Dongguan Ziitek Electronic Material and Technology Ltd. is a professional manufacturer of thermal interface materials with many years of industry experience. Integrating R&D, production, sales, and technical services, the company offers a comprehensive product line covering thermally conductive silicone pads, thermal conductive grease/paste,thermally conductive graphite sheets, phase change materials, thermally conductive plastics, thermal gel , silicone foam, silicone-free thermal pads etc.We adhere to strict quality standards and provide customized solutions based on customer requirements. Our products are widely used in electronics, new energy, telecommunications, industrial control, and other fields, earning the trust of customers both domestically and internationally through our proven capabilities.

Products description

The TIF^®100-20-16E Series It is purple in color and is suitable for lamps and Cpus.Thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

Features

>Good thermal conductive: 2.0 W/mK
>Soft and Compressible for low stress applications
>Available in varies thickness
>Soft and compressible for low stress applications
>Good thermal performance
>High tack surface reduces contact resistance
>RoHS compliant
>UL recognized

Applications

>CPU
>PCB/CPU/LED
>High speed mass storage drives
>Heat Sinking Housing at LED-lit BLU in LCD
>RDRAM memory modules
>Micro heat pipe thermal solutions
>Automotive engine control units
>Telecommunication hardware
>Handheld portable electronics
>Routers

>Home appliance industry
>Power module
>Wearable device
>Solar photovoltaic panel
>LED lighting fixtures

Typical Properties of TIF^®100-20-16E Series
Property	Value		Test method
Color	Purple		Visual
Construction & Compostion	Ceramic filled silicone elastomer		******
Density(g/cm³)	2.7		ASTM D792
Thickness Range(inch/mm)	0.010~0.020	0.030~0.200	ASTM D374
	0.25~0.50	0.75~5.00
Hardness (Shore 00)	65	35	ASTM 2240
Recommended Operating Temperature (℃)	-40 to 200		******
Breakdown Voltage (V/mm)	≥5500		ASTM D149
Dielectric Constant @ 1MHz	5.0		ASTM D150
Volume Resistivity (Ohm-meter)	＞1.0X10¹²		ASTM D257
Flame rating	V-0		UL 94 (E331100)
Thermal conductivity	2.0W/m-K		ASTM D5470
	2.0W/m-K		ISO22007

Product Specifications
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X16" (406 mm×406 mm)

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF^® series is availablein custom shapes and various forms.
For other thicknesses or more information, please contact us.

Flexible Thermal Conductive Pad With High Stickiness Surface For Enhanced Heat Dissipation In PCB CPU And LED Applications 0

Our services

Online-service : 12 hours , Inquiry reply within fastest.

Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

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Contact Details

Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

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Keywords: Thermal Conductive Pad

Flexible Thermal Conductive Pad With High Stickiness Surface For Enhanced Heat Dissipation In PCB CPU And LED Applications

Flexible Thermal Conductive Pad With High Stickiness Surface For Enhanced Heat Dissipation In PCB CPU And LED Applications

Flexible Thermal Conductive Pad With High Stickiness Surface For Enhanced Heat Dissipation In PCB CPU And LED Applications

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