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Thermal Gap Filler Designed for Heat Dissipation in LED TV and LED Lit Lamps Replacing Bergquist Sil-PAD900 for CPU Cooling

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thermally conductive filler

thermally conductive filler

High Temperature Thermal Gap Filler

High Temperature Thermal Gap Filler

Conductive Thermal gap filler For Power Electronics Applications 1.5 W/M-K

Conductive Thermal gap filler For Power Electronics Applications 1.5 W/M-K

Certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
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Thermal Gap Filler Designed for Heat Dissipation in LED TV and LED Lit Lamps Replacing Bergquist Sil-PAD900 for CPU Cooling

Thermal Gap Filler Designed for Heat Dissipation in LED TV and LED Lit Lamps Replacing Bergquist Sil-PAD900 for CPU Cooling
Thermal Gap Filler Designed for Heat Dissipation in LED TV and LED Lit Lamps Replacing Bergquist Sil-PAD900 for CPU Cooling
Thermal Gap Filler Designed for Heat Dissipation in LED TV and LED Lit Lamps Replacing Bergquist Sil-PAD900 for CPU Cooling Thermal Gap Filler Designed for Heat Dissipation in LED TV and LED Lit Lamps Replacing Bergquist Sil-PAD900 for CPU Cooling Thermal Gap Filler Designed for Heat Dissipation in LED TV and LED Lit Lamps Replacing Bergquist Sil-PAD900 for CPU Cooling

Large Image :  Thermal Gap Filler Designed for Heat Dissipation in LED TV and LED Lit Lamps Replacing Bergquist Sil-PAD900 for CPU Cooling

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF100-16-38UF
Document: TIF100-16-38UF_Data Sheet.pdf
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: Negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-7work days
Payment Terms: T/T
Supply Ability: 10000/day
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Thermal Gap Filler Designed for Heat Dissipation in LED TV and LED Lit Lamps Replacing Bergquist Sil-PAD900 for CPU Cooling

Description
Products Name: Thermal Gap Filler Designed For Heat Dissipation In LED TV And LED Lit Lamps Replacing Bergquist Sil-PAD900 For CPU Cooling Thickness: Available In Varies Thicknes
Hardness( Shore 00): 75 Construction: Ceramic Filled Silicone Elastomer
Density(g/cm³）: 2.1 Thermal Conductivity(W/mK): 1.6
Keywords: Thermal Gap Filler Application: LED TV，LED Lit Lamps， CPU Cooling
Highlight:

thermally conductive filler

,

high temperature phase change materials

,

Thermal Gap Filler 2.75 g/cc

Thermal Gap Filler Designed for Heat Dissipation in LED TV and LED Lit Lamps Replacing Bergquist Sil-PAD900 for CPU Cooling
Product Overview

The TIF®100-16-38UF is an electrically insulating, thermally conductive interface material designed to fill air gaps between heating elements and heat dissipation components. This material is ideal for applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.

Key Features
  • Excellent thermal conductivity: 1.6 W/mK
  • Moldable for complex parts and assemblies
  • Soft and compressible for low-stress applications
  • Available in various thicknesses
  • Outstanding thermal performance
Applications
  • Micro heat pipe thermal solutions
  • Automotive engine control units
  • Telecommunication hardware
  • RDRAM memory modules
  • Display cards
  • Motherboards/mainboards
Technical Specifications of TIF®100-16-38UF Series
Property Value Test Method
Color Deep red Visual
Construction Ceramic filled silicone elastomer -
Density (g/cm³) 2.1 ASTM D792
Thickness Range (inch/mm) 0.010~0.020 / 0.25~0.50
0.030~0.200 / 0.75~5.00		 ASTM D374
Hardness (Shore 00) 75 ASTM 2240
Operating Temperature -40 to 200℃ -
Breakdown Voltage (V/mm) ≥ 5500 ASTM D149
Dielectric Constant @1Mhz 5.5 ASTM D150
Volume Resistivity (Ohm-meter) ≥1.0×10¹² ASTM D257
Thermal Conductivity (W/m-K) 1.6 ASTM D5470 / ISO22007
Fire Rating V-0 UL 94 (E331100)
Product Specifications

Standard Thickness: 0.010" (0.25 mm) – 0.200" (5.00 mm) with increments of 0.010" (0.25 mm)

Standard Size: 16"×16" (406 mm × 406 mm)

Component Codes

Reinforcement Fabric: FG (Fiberglass)

Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)

Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

TIF®100-16-38UF Thermal Gap Filler product image
Why Choose Ziitek?
  • Our value message: "Do it right the First time, total quality control"
  • Core competency in thermal conductive interface materials
  • Competitive advantage products
  • Confidentiality agreement and business secret contracts
  • Free sample offerings
  • Quality assurance contracts
Ziitek Culture
Quality Do it right the first time, total quality control
Effectiveness Work precisely and thoroughly for effectiveness
Service Quick response, on-time delivery and excellent service
Team Work Complete teamwork across all departments to support and service customer satisfaction

Tag:

thermally conductive filler,

thermal conductivity silicone,

high temperature phase change materials

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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