logo
Home ProductsThermal Gap Filler

High Thermal Conductivity 8.0W/MK Low Dielectric Thermally Conductive Gap Filler Pads For Semiconductor Microwave Components

Certification
China Dongguan Ziitek Electronical Material and Technology Co., Ltd certification
China Dongguan Ziitek Electronical Material and Technology Co., Ltd certification
Customer Reviews
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

I'm Online Chat Now

High Thermal Conductivity 8.0W/MK Low Dielectric Thermally Conductive Gap Filler Pads For Semiconductor Microwave Components

High Thermal Conductivity 8.0W/MK Low Dielectric Thermally Conductive Gap Filler Pads For Semiconductor Microwave Components
High Thermal Conductivity 8.0W/MK Low Dielectric Thermally Conductive Gap Filler Pads For Semiconductor Microwave Components High Thermal Conductivity 8.0W/MK Low Dielectric Thermally Conductive Gap Filler Pads For Semiconductor Microwave Components High Thermal Conductivity 8.0W/MK Low Dielectric Thermally Conductive Gap Filler Pads For Semiconductor Microwave Components

Large Image :  High Thermal Conductivity 8.0W/MK Low Dielectric Thermally Conductive Gap Filler Pads For Semiconductor Microwave Components

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF100N 8085-06
Document: TIF100N 8085-06_Data Sheet.pdf
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: Negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-7 work days
Payment Terms: T/T
Supply Ability: 10000/day

High Thermal Conductivity 8.0W/MK Low Dielectric Thermally Conductive Gap Filler Pads For Semiconductor Microwave Components

Description
Product Name: High Thermal Conductivity 8.0W/MK Low Dielectric Thermally Conductive Gap Filler Pads For Semiconductor Microwave Components Recommended Operating Temperature (°C): -40 To 200℃
Hardness: 85 Shore 00 Breakdown Strength(V/mm): ≥3000
Sample: Sample Free Construction: Ceramic Filled Silicone Elastomer
Keywords: High Thermal Conductivity Thermal Pad Thermal Conductivity(W/mk): 8.0W/mK
Flame Rating: UL 94 V-0 Application: Semiconductor Microwave Components
Highlight:

High thermal conductivity gap filler pads

,

Thermally conductive pads for semiconductors

,

Low dielectric thermal gap filler

High Thermal Conductivity 8.0W/MK Low Dielectric Thermally Conductive Gap Filler Pads For Semiconductor Microwave Components
Product Overview

The TIF®100N 8085-06 Series is a thermal pad that combines excellent heat dissipation performance with reliable structural support capability. It can fill interface gaps, establish efficient thermal conduction pathways, and provide stable mechanical support for stacked or adjacent electronic components, effectively meeting long-term durability requirements. In addition, the material itself has low dielectric properties, which can effectively reduce energy loss during high-frequency signal transmission and ensure signal integrity.

Key Features
  • Low dielectric constant effectively reduces signal loss
  • Excellent thermal conductivity
  • Excellent weather resistance and aging resistance
  • Excellent long-term reliability
Applications
  • Millimeter wave radar
  • Semiconductor microwave components
  • 5G base station
  • RF power amplifier
  • High performance computing
Technical Specifications of TIF®100 8085-06 Series
Property Value Test Method
Color white Visual
Construction Ceramic filled silicone elastomer -
Density (g/cm³) 1.6 ASTM D792
Thickness Range (inch/mm) 0.012~0.120
0.30~3.00
ASTM D374
Hardness (Shore 00) 85 ASTM 2240
Recommended Operating Temperature -40 to 200℃ -
Breakdown Strength (V/mm) ≥3000 ASTM D149
Dielectric Constant @1MHz 4.0 ASTM D150
Volume Resistivity (Ohm-meter) >1.0×10¹² ASTM D257
Flame Rating V-0 UL 94 (E331100)
Thermal Conductivity (W/m-K) 8.0 ASTM D5470
ISO22007
Product Specifications

Standard Thickness: 0.012" (0.30 mm)~0.120" (3.00 mm)

Standard Size: 4.7"×4.7" (120 mm×120 mm)

The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

TIF®100N 8085-06 Series Thermal Gap Filler Pad
Packaging & Lead Time

Packaging Details:

  • PET film or foam for protection
  • Paper card to separate each layer
  • Export carton inside and outside
  • Customized packaging available to meet customer requirements

Lead Time: 5000 pieces - To be negotiated

Company Profile

Ziitek is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:

All products are compliant with UL94 V-0, SGS and ROHS standards.

Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL

Our Services
  • Online service: 12 hours, inquiry reply within fastest response time
  • Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8)
  • Well-trained & experienced staff answering all inquiries in English
  • Standard export carton or marked with customer's information or customized
  • Free samples available
  • After-service support: If products don't work as expected, we provide satisfactory solutions with proper proof
Frequently Asked Questions
Q: What thermal conductivity test method was used to achieve the values given on the data sheets?
A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.
Q: Is GAP PAD offered with an adhesive?
A: Currently, most thermal gap pad surfaces have double side natural inherent tack. Non-stick surface can also be treated according to customer's requirements.
Q: What are thermal pads used for?
A: Thermal pads transfer heat away from hot electronic parts like computer chips into a metal cooler or heat sink. They fill empty air spaces between surfaces, provide electrical safety, and keep parts from getting too hot.
Q: Is a thermal pad effective?
A: While a pad is not as compressible as a paste, the range of available materials means thermal pads are extremely effective with any substrate.
Q: What is Thermal Conductivity?
A: Thermal conductivity indicates a material's ability to conduct heat and is typically measured in W/m*K. Under the same testing conditions, a higher thermal conductivity generally indicates better heat-conduction capability.
Q: What is Thermal Resistance?
A: Thermal resistance indicates the resistance to heat flow through a material or interface and is typically expressed in K/W or °C/W. Lower thermal resistance generally means that heat can pass through the material more efficiently.

Contact Details
Dongguan Ziitek Electronical Material and Technology Co., Ltd

Contact Person: Dana Dai

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)