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2.5W/mK Silicone Thermal Pad EV Thermal Interface Material For Battery Pack Thermal Management

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High Temperature Thermal Gap Filler

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Conductive Thermal gap filler For Power Electronics Applications 1.5 W/M-K

Conductive Thermal gap filler For Power Electronics Applications 1.5 W/M-K

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2.5W/mK Silicone Thermal Pad EV Thermal Interface Material For Battery Pack Thermal Management

2.5W/mK Silicone Thermal Pad EV Thermal Interface Material For Battery Pack Thermal Management
2.5W/mK Silicone Thermal Pad EV Thermal Interface Material For Battery Pack Thermal Management
2.5W/mK Silicone Thermal Pad EV Thermal Interface Material For Battery Pack Thermal Management 2.5W/mK Silicone Thermal Pad EV Thermal Interface Material For Battery Pack Thermal Management 2.5W/mK Silicone Thermal Pad EV Thermal Interface Material For Battery Pack Thermal Management

Large Image :  2.5W/mK Silicone Thermal Pad EV Thermal Interface Material For Battery Pack Thermal Management

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF100 2540-11
Document: TIF100 2540-11_Data Sheet.pdf
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: Negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-7 work days
Payment Terms: T/T
Supply Ability: 10000/day
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2.5W/mK Silicone Thermal Pad EV Thermal Interface Material For Battery Pack Thermal Management

Description
Products Name: 2.5W/mK Silicone Thermal Pad EV Thermal Interface Material For Battery Pack Thermal Management Continuos Use Temp: -40℃ To 200℃
Application: EV Battery Pack Density: 3.1g/cm³
Hardness: 65/40 Shore 00 Color: Dark Gray
Thermal Conductivity: 2.5W/m-K Thickness: 0.010~0.200inch / 0.25~5.0mmT
Construction: Ceramic Filled Silicone Elastomer Keywords: EV Thermal Interface Material
Highlight:

2.5W/mK silicone thermal pad

,

EV battery thermal interface material

,

thermal gap filler for battery packs

2.5W/mK Silicone Thermal Pad EV Thermal Interface Material For Battery Pack Thermal Management
Product Overview

The TIF®100 2540-11 Series is a versatile thermal pad with balanced performance. It offers good thermal conductivity and moderate hardness. This balanced design combines good surface fit and excellent operational convenience, providing effective heat transfer paths and basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium-power heat dissipation needs, achieving an optimal balance between cost and performance.

Key Features
  • Good thermal conductivity
  • Moldability for complex parts
  • Soft and compressible for low stress applications
  • Naturally tacky needing no further adhesive coating
  • High tack surface reduces contact resistance
Applications
  • Heat dissipation structure for radiators
  • Telecommunication equipment
  • Automotive electronics
  • Battery packs for electric vehicles
  • LED TV and lamps
  • Telecommunication hardware
  • Handheld portable electronics
  • Semiconductor automated test equipment (ATE)
  • CPU
Technical Specifications of TIF®️100 2540-11Series 
Property Value Test Method
Color Dark Gray Visual
Construction & Composition Ceramic filled silicone elastomer -
Density 3.1g/cm³ ASTM D792
Thickness range 0.010~0.200inch / 0.25~5.0mm ASTM D374
Hardness 65/40 Shore 00 ASTM 2240
Breakdown Strength(V/mm) ≥5500 ASTM D149
Recommended Operating Temp -40 ~200℃ -
Dielectric Constant @1MHz 4.8 ASTM D150
Volume Resistivity ＞1.0X10¹² Ohm-meter ASTM D257
Fire rating V-0 UL94 (E331100)
Thermal conductivity 2.5W/mK ASTM D5470
Product Specifications

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)

Standard Size: 16"X16" (406 mm×406 mm)

Component Codes:

Reinforcement Fabric: FG (Fiberglass)

Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)

Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

TIF®100 2540-11 Series Thermal Silicone Pad
Packaging & Lead Time
  • With PET film or foam for protection
  • Use Paper Card To Separate Each Layer
  • Export carton inside and outside
  • Meet with customers' requirement-customized

Lead Time: Quantity(Pieces): 5000 | Est. Time(days): To be negotiated

Frequently Asked Questions
What is a Thermal Silicone Pad?
A thermal silicone pad is a pre-formed TIM typically made of a silicone-based material and thermally conductive fillers. It is designed to fill gaps between heat sources and heat sinks. Depending on the product formulation, thermal silicone pads can also provide electrical insulation.
What are the advantages of Thermal Silicone Pads?
Key advantages include easy installation, controlled thickness, good flexibility, and effective gap-filling capability. Depending on the application, thermal silicone pads can also be designed with different levels of thermal conductivity, hardness, flame resistance, and electrical insulation.
Is a thinner Thermal Silicone Pad always better?
Not necessarily. If the pad is too thin to adequately fill the actual gap, proper interface contact may not be achieved. The appropriate thickness should be selected based on the actual structural tolerances and application requirements.
What are the common thicknesses of Thermal Silicone Pads?
Different product series can be available in thicknesses ranging from very thin pads to several millimeters or even thicker options. The appropriate thickness should be determined based on the customer's gap, compression requirements, and assembly structure.
Can Thermal Silicone Pads be customized in size?
Yes. Thermal silicone pads can be customized according to the customer's product structure, including length, width, thickness, and complex shapes. Die-cutting, punching, and other processing methods can also be used to produce customized parts.
Can Thermal Silicone Pads have an adhesive backing?
Some thermal silicone pads can be supplied with single-sided or double-sided adhesive backing. The adhesive is mainly used to assist with material positioning and installation. The appropriate adhesive should be selected according to the operating temperature and application environment.

Tag:

thermally conductive filler,

thermal conductivity silicone,

high temperature phase change materials

Contact Details
Dongguan Ziitek Electronical Material and Technology Co., Ltd

Contact Person: Dana Dai

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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