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Customized Electrically Insulating Thermal Pad 1.5-16W/mK Heat Dissipation OEM Custom Size For GPU/CPU/LED

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Best Products
thermally conductive filler

thermally conductive filler

High Temperature Thermal Gap Filler

High Temperature Thermal Gap Filler

Conductive Thermal gap filler For Power Electronics Applications 1.5 W/M-K

Conductive Thermal gap filler For Power Electronics Applications 1.5 W/M-K

Certification
China Dongguan Ziitek Electronical Material and Technology Co., Ltd certification
China Dongguan Ziitek Electronical Material and Technology Co., Ltd certification
Customer Reviews
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

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Customized Electrically Insulating Thermal Pad 1.5-16W/mK Heat Dissipation OEM Custom Size For GPU/CPU/LED

Customized Electrically Insulating Thermal Pad 1.5-16W/mK Heat Dissipation OEM Custom Size For GPU/CPU/LED
Customized Electrically Insulating Thermal Pad 1.5-16W/mK Heat Dissipation OEM Custom Size For GPU/CPU/LED
Customized Electrically Insulating Thermal Pad 1.5-16W/mK Heat Dissipation OEM Custom Size For GPU/CPU/LED Customized Electrically Insulating Thermal Pad 1.5-16W/mK Heat Dissipation OEM Custom Size For GPU/CPU/LED Customized Electrically Insulating Thermal Pad 1.5-16W/mK Heat Dissipation OEM Custom Size For GPU/CPU/LED

Large Image :  Customized Electrically Insulating Thermal Pad 1.5-16W/mK Heat Dissipation OEM Custom Size For GPU/CPU/LED

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF100-30-01UF
Document: TIF100-30-01UF_Data Sheet.pdf
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: Negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-7 work days
Payment Terms: T/T
Supply Ability: 10000/day
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Customized Electrically Insulating Thermal Pad 1.5-16W/mK Heat Dissipation OEM Custom Size For GPU/CPU/LED

Description
Product Name: AI Server Thermal Pad Offering Excellent Thermal Conductivity And Electrical Insulation For Battery Pack Thermal Management Recommended Operating Temperature (°C): -40 To 200℃
Hardness: 75 Shore 00 Application: GPU/CPU/LED
Breakdown Strength(V/mm): ≥5500 Sample: Sample Free
Keywords: Electrically Insulating Thermal Pad Thermal Conductivity（W/mk）: 3.0W/mK
Construction: Ceramic Filled Silicone Elastomer Flame Rating: UL 94 V-0
Highlight:

electrically insulating thermal pad

,

custom size thermal gap filler

,

GPU CPU LED heat dissipation pad

Customized Electrically Insulating Thermal Pad 1.5-16W/mK Heat Dissipation OEM Custom Size For GPU/CPU/LED
Product Overview

The TIF®100-30-01UF Series is a structurally supportive thermal pad designed to provide high heat dissipation while ensuring structural support and durability. It reliably fills interface gaps, transfers heat, and offers mechanical support for stacked components, resisting compressive deformation. This product is ideal for applications requiring a balance between heat dissipation, insulation, and mechanical stability.

Key Features
  • High thermal conductivity
  • Good softness and fillability property
  • Self-adhesive without need for additional surface adhesives
  • Good insulation performance
Applications
  • Power tools
  • Network communication products
  • Electric vehicle batteries
  • Computer CPU/GPU Cooling
  • New energy vehicle power systems
  • Signal communication
  • New energy vehicle
  • Motherboard chip
  • Radiator
  • AI Processors AI Server
  • Display card
  • Power supply
  • Heat pipe thermal solutions
Technical Specifications of TIF®100-30-01UF Series
Property Value Test Method
Color Black Visual
Construction Ceramic filled silicone elastomer Visual
Density (g/cm³) 2.9 ASTM D792
Thickness Range (inch/mm) 0.010~0.020 | 0.030~0.200
0.25~0.50 | 0.75~5.00		 ASTM D374
Hardness (Shore 00) 75 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ZKTM J2025
Breakdown Strength (V/mm) ≥5500 ASTM D149
Dielectric Constant @1MHz 5.3 ASTM D150
Volume Resistivity (Ohm-meter) ＞1.0×10¹² ASTM D257
Flame Rating V-0 UL 94 (E331100)
Thermal Conductivity (W/m-K) 3.0 ASTM D5470
ISO22007
Product Specifications

Standard Thickness: 0.010" (0.25 mm)～0.200" (5.00 mm), with increments of 0.010" (0.25 mm).

Standard Size: 16"×16" (406 mm×406 mm)

Component Codes:

  • Reinforcement Fabric: FG (Fiberglass)
  • Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
  • Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

TIF Series Thermal Pad Product Image
Packaging & Lead Time

Packaging Details:

  • PET film or foam for protection
  • Paper card to separate each layer
  • Export carton inside and outside
  • Customized packaging available to meet customer requirements

Lead Time: 5000 pieces - To be negotiated

Company Profile

Ziitek is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:

All products are compliant with UL94 V-0, SGS and ROHS standards.

Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL

Frequently Asked Questions
Q: What thermal conductivity test method was used to achieve the values given on the data sheets?
A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.
Q: Is GAP PAD offered with an adhesive?
A: Currently, most thermal gap pad surfaces have double side natural inherent tack. Non-stick surface can also be treated according to customer's requirements.
Q: What are thermal pads used for?
A: Thermal pads transfer heat away from hot electronic parts like computer chips into a metal cooler or heat sink. They fill empty air spaces between surfaces, provide electrical safety, and keep parts from getting too hot.
Q: Is a thermal pad effective?
A: While a pad is not as compressible as a paste, the range of available materials means thermal pads are extremely effective with any substrate.

Tag:

thermally conductive filler,

thermal conductivity silicone,

high temperature phase change materials

Contact Details
Dongguan Ziitek Electronical Material and Technology Co., Ltd

Contact Person: Dana Dai

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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