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Thermal Gap Filler Custom Silicone Pads With 8.5W/mK High Thermal Conductivity For Heat Transfer In GPU CPU LED Components

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China Dongguan Ziitek Electronical Material and Technology Co., Ltd certification
China Dongguan Ziitek Electronical Material and Technology Co., Ltd certification
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The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

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I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

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Thermal Gap Filler Custom Silicone Pads With 8.5W/mK High Thermal Conductivity For Heat Transfer In GPU CPU LED Components

Thermal Gap Filler Custom Silicone Pads With 8.5W/mK High Thermal Conductivity For Heat Transfer In GPU CPU LED Components
Thermal Gap Filler Custom Silicone Pads With 8.5W/mK High Thermal Conductivity For Heat Transfer In GPU CPU LED Components Thermal Gap Filler Custom Silicone Pads With 8.5W/mK High Thermal Conductivity For Heat Transfer In GPU CPU LED Components Thermal Gap Filler Custom Silicone Pads With 8.5W/mK High Thermal Conductivity For Heat Transfer In GPU CPU LED Components

Large Image :  Thermal Gap Filler Custom Silicone Pads With 8.5W/mK High Thermal Conductivity For Heat Transfer In GPU CPU LED Components

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF700RES
Document: TIF700RES_Data Sheet..pdf
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-7 work days
Payment Terms: T/T
Supply Ability: 10000/day

Thermal Gap Filler Custom Silicone Pads With 8.5W/mK High Thermal Conductivity For Heat Transfer In GPU CPU LED Components

Description
Products Name: 8.5W/MK High Temperature 0.5mm Custom Silicone Gap Filler Electric Thermal Pads For Gpu Cpu Led Keywords: Silicone Thermal Pads
Continuos Use Temp: -40℃ To 200℃ Density: 3.5g/cm³
Hardness: 10 Shore 00 Color: Gray
Thermal Conductivity: 8.5W/m-K Thickness: 0.04~0.12inch / 1.0~3.0mmT
Construction: Ceramic Filled Silicone Elastomer Application: Heat Transfer In GPU CPU LED Components
Highlight:

8.5W/mK silicone thermal pads

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GPU CPU thermal gap filler

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LED thermal pads -40℃ to 200℃

Thermal Gap Filler Custom Silicone Pads With 8.5W/mK High Thermal Conductivity For Heat Transfer In GPU CPU LED Components
Product Description

TIF®700RES Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effectively enhances the efficiency and life-time of the heat-generating electronic components.

Features
  • Excellent thermal conductivity: 8.5W/mK
  • Naturally tacky needing no further adhesive coating
  • High compliance adapts to various pressure application environments
  • Available in different thickness options
  • RoHS compliant
  • UL recognized
Applications
  • Heat dissipation structure for radiators
  • Telecommunication equipment
  • Automotive electronics
  • Battery packs for electric vehicles
  • LED TV and lamps
  • Telecommunication hardware
  • Handheld portable electronics
  • Semiconductor automated test equipment (ATE)
  • CPU
Typical Properties of TIF®700RES Series
Property Value Test method
Color Gray Visual
Construction & Composition Ceramic filled silicone elastomer *******
Density 3.5g/cm³ ASTM D792
Thickness range 0.016~0.200inch / 0.40~5.0mm ASTM D374
Hardness 10 Shore 00 ASTM 2240
Breakdown Voltage(V/mm) ≥5000 ASTM D149
Recommended Operating Temp -40 ~200℃ Ziitek Test Method
Dielectric Constant @1MHz 6.7 ASTM D150
Volume Resistivity >1.0X1012Ohm-meter ASTM D257
Fire rating V-0 UL94 (E331100)
Thermal conductivity 8.5W/mK ASTM D5470
Product Specifications

Standard Thickness: 0.016"(0.40mm)~ 0.200"(5.0mm) 

Standard Size: 16"X16"(406 mm×406 mm).

The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

8.5W/MK High Temperature Silicone Gap Filler Thermal Pads
Packaging Details & Lead Time

The packaging of thermal pad:

  • With PET film or foam for protection
  • Use Paper Card To Separate Each Layer
  • Export carton inside and outside
  • Meet with customers' requirement-customized

Lead Time: Quantity(Pieces):5000
Est. Time(days): To be negotiated

Company Profile

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease, Thermal Conductive plastic, Silicone Rubber, Silicone Foams, Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

Independent R&D team

How to Place an Order
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Contact Details
Dongguan Ziitek Electronical Material and Technology Co., Ltd

Contact Person: Dana Dai

Tel: +86 18153789196

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