AI Server Thermal Pad Offering Excellent Thermal Conductivity And Electrical Insulation For Battery Pack Thermal Management

The TIF®100-15-11UF Series is a structurally supportive thermal pad designed to provide high heat dissipation while also ensuring structural support and durability. It can reliably fill interface gaps, transfer heat, and offer mechanical support for stacked components, resisting compressive deformation. This product is an ideal choice for applications that require a balance between heat dissipation, insulation, and mechanical stability.

• Good thermal conductivity
• Good softness and fillability
• Self-adhesive without the need for additional surface adhesives
• Good insulation performance

• Power tools
• Network communication products
• Electric vehicle batteries
• Computer CPU/GPU Cooling
• New energy vehicle power systems
• Signal communication
• New energy vehicle
• Motherboard chip
• Radiator
• AI Processors AI Server
• Display card
• Power supply
• Heat pipe thermal solutions

Standard Thickness: 0.010" (0.25 mm)～0.200" (5.00 mm), with increments of 0.010" (0.25 mm).

Standard Size: 16"×16" (406 mm×406 mm)

Component Codes:
Reinforcement Fabric: FG (Fiberglass)
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

Packaging Details:

• PET film or foam for protection
• Paper card to separate each layer
• Export carton inside and outside
• Customized packaging available to meet customer requirements

Lead Time: 5000 pieces - To be negotiated

Ziitek is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:

• Thermal gap pad
• Thermal graphite sheet/film
• Thermal double-sided tape
• Thermal insulation pad
• Thermal grease
• Phase change material
• Thermal gel

All products are compliant with UL94 V-0, SGS and ROHS standards.

Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL

A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.

A: Currently, most thermal gap pad surfaces have double side natural inherent tack. Non-stick surface can also be treated according to customer's requirements.

A: Thermal pads transfer heat away from hot electronic parts like computer chips into a metal cooler or heat sink. They fill empty air spaces between surfaces, provide electrical safety, and keep parts from getting too hot.

A: While a pad is not as compressible as a paste, the range of available materials means thermal pads are extremely effective with any substrate.