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I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

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cpu

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Specific Gravity 2.7g/Cc CPU Thermal Gap Pad 1.5mm
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Specific Gravity 2.7 g/cc Outstanding Thermal Performance Conductive Pads for CPU The TIF160-20-10UF use a special process, with silicone as the base material, adding thermal conductive powder and flame ... Read More

2023-12-20 17:29:06

Fire Rating 94 V0 High Tack Surface Thermal Gap Filler Pad For CPU
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Fire Rating 94 V0 High Tack Surface Reduces Contact Resistance for CPU The TIF120N-50-10F is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between ... Read More

2024-01-12 10:03:29

2.5mmT Moldability For Complex Parts Gray Conductive Pads For CPU
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2.5mmT Moldability for Complex Parts Gray Conductive Pads for CPU The TIF7100M is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and ... Read More

2024-02-07 16:25:31

Factory Supply Variety Of Thicknesses Thermal Conductive Pad For CPU
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Factory Supply Variety of Thicknesses Thermal Conductive Pad for CPU The TIF7180Z is an extremely soft gap filling material rated at a thermal conductivity of 7.0W/m-K. It is specially formulated for high ... Read More

2024-04-10 17:12:46

Wholesale Customized Thermal Conductive Gap Filler For GPU CPU Cooling
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Wholesale Customized thermal conductive gap filler for GPU CPU Cooling Ziitek TIF7120HZ is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the ... Read More

2024-04-10 17:12:46

CPU Sponge Foam Material , Thermo Molded Dense Foam Sheets with 0.12 g / cm3 Specific Gravity
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CPU Sponge Foam Material , Thermo Molded Dense Foam Sheets with 0.12 g / cm3 Specific Gravity Z-Foam7000Y series are more than 100 compounds in EVA/PE foam series, and each compound has its own relevant ... Read More

2023-02-13 15:41:20

2.5W / mK CPU Heatsink 25 Shore 00 Thermally Conductive pad for Electronic Components -50 to 200℃
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2.5W / mK CPU Heatsink 25 Shore 00 Thermally Conductive pad for Electronic Components -50 to 200 Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal ... Read More

2023-03-15 17:05:15

CPU High Thermal Conductivity Silicone CE for RDRAM memory modules Gray with 1 l / g -K Heat Capacity
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CPU High Thermal Conductivity Silicone CE Gray with 1 l / g -K Heat Capacity The TIF100-15-11S thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat ... Read More

2021-08-20 15:52:28

High Thermal Conductivity Heat Dissipation Thermal Conductive Grease for CPU Heatsink Cooling
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High Thermal Conductivity Heat Dissipation Thermal Paste for CPU Heatsink Cooling The TIG780-38 products are the high-efficiency heat dissipation ones for the fillings between the electronic components and the ... Read More

2023-05-08 16:35:29

2.0 W/mK Ultrasoft CPU Heatsink Pad , Green Thermal Silicone Pads TIF100-20-07E thermal gap filler 45 Shore 00
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2.0 W/mK Ultrasoft CPU Heatsink Pad , Green Thermal Silicone Pads TIF100-20-07E thermal gap filler 45 Shore 00 Company Profile Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we ... Read More

2023-05-08 16:09:20

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