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Thermal Conductivity Silicone Thermal Gap Filler Pad Thermal Pad For Heatsink CPU GPU SSD IC LED Memory Modules

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

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Thermal Conductivity Silicone Thermal Gap Filler Pad Thermal Pad For Heatsink CPU GPU SSD IC LED Memory Modules

Thermal Conductivity Silicone Thermal Gap Filler Pad Thermal Pad For Heatsink CPU GPU SSD IC LED Memory Modules
Thermal Conductivity Silicone Thermal Gap Filler Pad Thermal Pad For Heatsink CPU GPU SSD IC LED Memory Modules
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Large Image :  Thermal Conductivity Silicone Thermal Gap Filler Pad Thermal Pad For Heatsink CPU GPU SSD IC LED Memory Modules

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF100C 10075-11
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
Detailed Product Description
Products Name: Thermal Conductivity Silicone Thermal Gap Filler Pad Thermal Pad For Heatsink CPU GPU SSD IC LED Memory Modules Thermal Conductivity& Compostion: 10.0W/m-K
Hardness: 75 Shore 00 Color: Gray
Specific Gravity: 3.3g/cc Thickness: 0.020"(0.50mm)~0.200"(5.00mm)
Construction: Ceramic Filled Silicone Elastomer Continuos Use Temp: -40℃ To 200℃
Application: Heatsink CPU GPU SSD IC LED Memory Modules Keywords: Thermal Gap Filler Pad
Highlight:

Heatsink Thermal Gap Filler Pad

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GPU Thermal Gap Filler Pad

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CPU Thermal Gap Filler Pad

Thermal Conductivity Silicone Thermal Gap Filler Pad Thermal Pad For Heatsink CPU GPU SSD IC LED Memory Modules

 

TIF®100C 10075-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components and liquid cooling plates or metal bases. lts flexibility and elasticity make it ideal for covering highly uneven surfaces. With excellent thermal conductivity, it efficiently transfers heat from heat-generating elements or PCBs to liquid cooling plates or metal heat dissipation structures,thereby improving the cooling efficiency of high-power electronic components and extending the lifespan of the equipment.

 

Features:

> Excellent thermal conductivity 10.0W/mK

> Self-adhesive without the need foradditional surface adhesive
> Highly compressible, soft, and elasticAvailable in various thicknesses
> Good chemical stability


Applications:

> Cooling components to the chassis of frame
> CPU and GPU processors and other chipsets
> High-performance computing (HPC)

> Industrial equipment
> Network communication devices

> New energy vehicles

Typical Properties of  TIF®100C 10075-11 Series
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Specific Gravity 3.3g/cc ASTM D297
thickness 0.020"(0.50mm)~0.200"(5.00mm) ASTM D374
Hardness (thickness<1.0mm) 75 (Shore 00) ASTM 2240
Continuos Use Temp -40 to 200℃ ******
Dielectric Breakdown Voltage >5500 VAC ASTM D149
Dielectric Constant 5.5MHz ASTM D150
Volume Resistivity ≥1.0X10¹²Ohm-meter ASTM D257
Fire rating 94 V0 equivalent UL
Thermal conductivity 10.0W/m-K ASTM D5470

Standard Thicknesses:

 

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.

 

Product Specification
Product Thicknesses: 0.020"(0.50mm)-0.200"(5.00mm)
Product Sizes:8" x 16"(203mm x406mm)
Custom die-cut shapes and thicknesses are available.Please contact us for details.
Store in a cool, dry place, away from fire and sunlight.
Thermal Conductivity Silicone Thermal Gap Filler Pad Thermal Pad For Heatsink CPU GPU SSD IC LED Memory Modules 0
Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

 

Our services

 

Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

 

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)