The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!
—— Peter Goolsby
I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials
—— Antonello Sau
Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!
4.0mmT new developed thermal conductive pad,Fire rating UL94 V0 For Heat pipe thermal solutions The TIF1160-05ES is a highly compliant Gap Pad material that is ideal for fragile component leads. The material is ... Read More
1.5 W/m-K professional factory and popular thermally conductive silicone rubber in High speed mass storage drives The TIF1200-01ES thermal silicone pad is a product with both performance and economy. It is a ... Read More
Two Component Epoxy Thermal Conductive Glue for Potting LED Lighting Heat Spreader TIE 280-12AB is a two compound, high thermal conductive, low temperature cured, long pot life, fire resistant epoxy encapsulant ... Read More
Gray LED High Temperature Thermally Conductive Pad Heat Dissipation 5W / mK for RDRAM memory modules 60 Shore 00 The TIF100-50-10F Series thermally conductive interface materials are applied to fill the air ... Read More
Telecommunication garnet Hardware Thermal Conductive Pad 6.2 W / mK , High Thermal sillicone rubber Pad The TIF600G Series thermally conductive interface materials are applied to fill the air gaps between the ... Read More
Pink 3.0W/mK Flexibility Thermal Conductive Pad TIF150-30-49U for Heat Housing at LED-lit 30 shore00, -40 to 160 The TIF150-30-49U thermally conductive interface materials are applied to fill the air gaps ... Read More
3.0 W/MK Silicone Thermal Conductive Pad For Telecommunication Hardware -50 to 200 The TIF150-30-19S thermally conductive interface materials are applied to fill the air gaps between the heating elements and ... Read More
Thermal Gap Filler in Telecommunication hardware The TIF100-03Fthermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal ... Read More
Non Toxic 3.0 g/cc Thermal conductive Pad TIF100-30-11S 3.0W / mK For Micro Heat Pipe 45 shore00 The TIF100-30-11S Series thermally conductive interface materials are applied to fill the air gaps between the ... Read More
CPU Heat Dissipation TIF100-30-05S blue High Thermal Conductive Pad 3.0 g / cc Specific Gravity 3.0W/mK The TIF100-30-05S thermally conductive interface materials are applied to fill the air gaps between the ... Read More