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Gray LED High Temperature Thermally Conductive Pad Heat Dissipation 5W / mK for RDRAM memory modules 60 Shore 00

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

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Gray LED High Temperature Thermally Conductive Pad Heat Dissipation 5W / mK for RDRAM memory modules 60 Shore 00

Gray LED High Temperature Thermally Conductive Pad Heat Dissipation 5W / mK for RDRAM memory modules 60 Shore 00
Gray LED High Temperature Thermally Conductive Pad Heat Dissipation 5W / mK for RDRAM memory modules 60 Shore 00 Gray LED High Temperature Thermally Conductive Pad Heat Dissipation 5W / mK for RDRAM memory modules 60 Shore 00 Gray LED High Temperature Thermally Conductive Pad Heat Dissipation 5W / mK for RDRAM memory modules 60 Shore 00

Large Image :  Gray LED High Temperature Thermally Conductive Pad Heat Dissipation 5W / mK for RDRAM memory modules 60 Shore 00

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF™100-50-10F Series
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5 work days
Supply Ability: 100000pcs/day
Detailed Product Description
Color: Gray Thermal Conductivity: 5.0W/m-K
Hardness: 60 Shore 00 Specific Gravity: 2.75 G/cc
Continuos Use Temp: -50 To 200℃ Dielectric Breakdown Voltage: >10000 VAC
Highlight:

thermally conductive pad

,

cpu thermal pad

,

Thermally Conductive Pad Gray

Gray LED High Temperature Thermally Conductive Pad Heat Dissipation 5W / mK for RDRAM memory modules 60 Shore 00

 
The TIF™100-50-10F Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

Features

>  Good thermal conductive: 5.0 W/mK 
>  Naturally tacky needing no further adhesive coating 
>  Soft and Compressible for low stress applications
>  Available in varies thickness

Applications

>  Cooling components to the chassis of frame  
>  High speed mass storage drives
>  Heat Sinking Housing at LED-lit BLU in LCD
>  LED TV and LED-lit lamps
>  RDRAM memory modules 
>  Micro heat pipe thermal solutions 
>  Automotive engine control units
>  Telecommunication hardware
>  Handheld portable electronics
>  Semiconductor automated test equipment (ATE)
 
Typical Properties of TIF™100-50-10F Series
Color

Gray

Visual
Construction &
Compostion
Ceramic filled silicone rubber
*****
Specific Gravity
2.75 g/cc ASTM D297
Heat Capacity
1 l /g-K ASTM C351
Hardness
60 Shore 00 ASTM 2240
Tensile Strength

45 psi

ASTM D412
Continuos Use Temp
-50 to 200℃

*****

Dielectric Breakdown Voltage
>10000 VAC ASTM D149
Dielectric Constant
5.5 MHz ASTM D150
Volume Resistivity
7.8X10" Ohm-meter ASTM D257
Fire rating
94 V0

equivalent UL

Thermal conductivity
5.0 W/m-K ASTM D5470
 
Gray LED High Temperature Thermally Conductive Pad Heat Dissipation 5W / mK for RDRAM memory modules 60 Shore 00 0
 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

 

Company profile

 

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

 

Factory Size:8000~10,000 square meters

Factory Country/Region:No.12, Xiju Road, Hengli Township, Dongguan City, Guangdong Province, P.R.China

Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

 

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)