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Telecommunication garnet Hardware Thermal Conductive Pad 6.2 W / mK , High Thermal sillicone rubber Pad

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

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I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

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Telecommunication garnet Hardware Thermal Conductive Pad 6.2 W / mK , High Thermal sillicone rubber Pad

Telecommunication garnet Hardware Thermal Conductive Pad 6.2 W / mK , High Thermal sillicone rubber Pad
Telecommunication garnet Hardware Thermal Conductive Pad 6.2 W / mK , High Thermal sillicone rubber Pad
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Large Image :  Telecommunication garnet Hardware Thermal Conductive Pad 6.2 W / mK , High Thermal sillicone rubber Pad

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF™600 Series
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5 work days
Supply Ability: 100000pcs/day
Detailed Product Description
Color: Garnet Thermal Conductivity: 6.2 W/m-K
Hardness: 50 Shore 00 Specific Gravity: 2.80 G /cc
Continuos Use Temp: -50 To 200℃ Dielectric Constant: 4.5 MHz
High Light:

thermal interface pad

,

heatsink thermal pad

,

Thermal Conductive Pad 6.2 W / mK

 
Telecommunication garnet Hardware Thermal Conductive Pad 6.2 W / mK , High Thermal sillicone rubber Pad
 
 
The TIF™600G Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

Features

> Good thermal conductive: 6.2 W/mK 
> Naturally tacky needing no further adhesive coating 
> Soft and Compressible for low stress applications
> Available in varies thickness

Applications

> Cooling components to the chassis of frame  
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules 
> Micro heat pipe thermal solutions 
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
 
Typical Properties of TIF™600G Series
Color
Garnet
Visual
Composite Thickness
Thermal Impedance@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20
Specific Gravity
2.85 g/cc
ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Heat Capacity
1 l/g-K
ASTM C351
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness
50 Shore 00
ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Tensile Strength
55 psi
ASTM D412
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp
-50 to 200℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Dielectric Breakdown Voltage
>10000 VAC
ASTM D149
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant
4.5 MHz
ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20
Volume Resistivity
3.2X1012
Ohm-meter
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity
6.2 W/m-K
ASTM D5470
Visua l/ ASTM D751
ASTM D5470

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Telecommunication garnet Hardware Thermal Conductive Pad 6.2 W / mK , High Thermal sillicone rubber Pad 0

 

TIF600G Series Datasheet-(E)-REV01.pdf

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Miss. Dana

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)