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thermally conductive adhesives

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Phase Changing Materials (38)

Thermal Conductive Pad (162)

Thermal Gap Filler (200)

Thermal Conductive Grease (24)

Thermal Insulation Materials (45)

Thermal Graphite Sheet (54)

Thermal Adhesive Tape (44)

Thermal Conductive Glue (12)

Thermal Conductive Adhesive (10)

Thermal Conductive Plastic (20)

Sponge Foam Material (10)

PET Double Sided Tape (8)

Thermal Gap Pad (403)

Thermal Conductive Gel (23)

Silicone Foam Gasket (11)

Silicone Free Gap Filler Pad (14)

Shielding Absorbing Materials (19)

Thermal Conductivity Sharp Metal (2)

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification

The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

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thermally conductive adhesives

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2.0W/mK PINK High Voltage Isolation Thermal Gap Filler, TIF100-20-15S Cooling Heatsink 45 Shore 00 -50 to 200℃
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2.0W/mK PINK High Voltage Isolation Thermal Gap Filler, TIF100-20-15S Cooling Heatsink 45 Shore 00 -50 to 200 Company Profile With a wide range, good quality, reasonable prices and stylish designs, Ziitek ... Read More

2021-08-20 16:09:28

China company supplied Heatsink Cooling 4W Thermal Gap Filler Ultra soft Low Thermal Resistance for Memory Modules
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China company supplied Heatsink Cooling 4W Thermal Gap Filler Ultra soft Low Thermal Resistance for Memory Modules The TIF100-40-12U thermally conductive interface materials are applied to fill the air gaps ... Read More

2023-05-08 16:08:14

Semiconductor Automated Test Equipment Thermal Gap Filler 1.5 W/MK
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Semiconductor automated test equipment (ATE) Thermal Gap Filler For CPU Heatsink Cooling The TIF100-15-07E use a special process, with silicone as the base material, adding thermal conductive powder and flame ... Read More

2023-05-08 16:15:03

Compressible Thermal Gap Filler For Semiconductor Automated Test Equipment, High tack surface reduces resistance
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Compressible Thermal Gap Filler For Semiconductor Automated Test Equipment, High tack surface reduces resistance The TIF100-12F thermally conductive interface materials are applied to fill the air gaps between ... Read More

2023-05-08 16:15:43

Soft Compressible siliocne gray Thermally Gap Filler TIF100-02S For RDRAM Memory Modules 1.5W/m-K,45 shore00 hardness
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Semiconductor automated test equipment (ATE) Ziitek Thermal Gap Filler in MB application TIF100-02S The TIF100-02S thermally conductive interface materials are applied to fill the air gaps between the heating ... Read More

2023-05-08 16:16:16

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