The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!
—— Peter Goolsby
I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials
—— Antonello Sau
Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!
Glass Fiber Backing Thermal Adhesive Tape Easy To Stamping Processing For LED Mount Heat Sink The TIA808FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power ... Read More
-50 - 180 Continuous Use Temp Acrylic Adhesive Tape with Ceramic Filled Silicone Elastomer The TIA808 Series products are mostly used for bonding heat dissipation fins, microprocessors and other power ... Read More
Best sell China manufacturer 2w pink silicone thermal conductive pad TIF140-20-15E for heating pipe thermal solutions The TIF140-20-15ESeries thermally conductive interface materials are applied to fill the air ... Read More
Heat Transfer Silicone Pad Thermal Pads Gap Filling Materials GPU Desktop Notebook The TIF180-05S is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. ... Read More
2W / MK Cooling Thermal Conductive Silicone Adhesive Gap Insulation Pad The TIF120FG-20-15S is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This ... Read More
The TIA810 Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low ... Read More
Cpu Thermal Pad 4.0W/MK With 45 Shore 00 Hardness For RDRAM Memory Modules The TIF100-40-11S Series is recommended for applications that require a minimum amount of pressure on components. The viscoelastic ... Read More
Blue Color Electronic Thermal Gap Filler , Gpu Ic Chip Thermal Conductive Pad The TIF5100S thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat ... Read More
2.8W thermal conductivity thermal gap filler pad for LED light heat sinking The TIF310FG thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat ... Read More
4.5mmT RoHS compliant silicone pads for Automotive electronics The TIF1180-01US is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material ... Read More