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I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

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high temperature adhesive

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2.5W / mK Low Viscosity adhesive Thermal Conductive Glue with -40℃ - 130℃ Service Temperature 85 Shore D
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2.5W / mK Low Viscosity Thermal Conductive Glue with -40 - 130 Service Temperature TIE 280-25AB is a two compound, high thermal conductive, low temperature cured, long pot life, fire resistant epoxy encapsulant ... Read More

2023-04-04 11:11:27

Two-Component RoHs compliant 2.5W/mK Thermal Conductive Glue for LED lighting
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Two-Component RoHs compliant 2.5W/mK Thermal Conductive Glue for LED lighting Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturi... Read More

2024-12-30 15:43:24

Thermal Conductive Glue TIS680-28A/B
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-40 - 200 LED Lighting Thermal Conductive Glue with Two Component Fire Resistant Silica Encapsulant TIS 680-28AB is a two-component, high thermal conductive, low temperature cured, long pot life, fire resistant ... Read More

2025-11-26 15:51:11

Low Temperature Melting Phase Changing Materials PCM 5.0 W/mK T-PCM T558 Hi-Flow PCS Kenflow
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Low Temperature Melting Phase Changing Materials PCM 5.0 W/mK T-PCM T558 Hi-Flow PCS Kenflow TIC800G series is low melting point thermal interface material. At 50, TIC800G series begins to soften and flow, ... Read More

2023-04-04 10:58:33

Low Melting Materials Customized High Quality Phase Change Materials For Notebook
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Low Melting Materials Customized High Quality Phase Change Material For Notebook TIC812G series is low melting point thermal interface material. At 50, TIC800G series begins to soften and flow, filling the ... Read More

2024-08-08 09:08:13

High Frequency Microprocessors 0.95 W/mK Thermal changing materials Low Resistance -25℃ - 125℃
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High Frequency Microprocessors Thermal Interface Pad Low Resistance -25 - 125 The TIC800P Series is low melting point thermal interface material. At 50, The TIC800P Series begins to soften and flow, filling the ... Read More

2023-02-13 15:55:53

Gray -25℃ - 125℃ Thermal Interface Material Phase Change for High Power LED Lights
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Gray -25 - 125 Thermal Interface Material Phase Change for High Power LED Lights TIC805G series is low melting point thermal interface material. At 50, TIC800G series begins to soften and flow, filling the ... Read More

2023-04-04 10:58:58

Cpu Thermal Pad 4.0W/MK With 45 Shore 00 Hardness For RDRAM Memory Modules
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Cpu Thermal Pad 4.0W/MK With 45 Shore 00 Hardness For RDRAM Memory Modules The TIF100-40-11S Series is recommended for applications that require a minimum amount of pressure on components. The viscoelastic ... Read More

2025-08-22 09:34:42

High Thermal Conductive 6 W / mK Carbon Graphite Materials for Notebook Computers
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High Thermal Conductive 6 W / mK Carbon Graphite Materials for Notebook Computers The TIR620-06 Series products are high-performance and heat-conductive interface materials with the reasonable prices. They can ... Read More

2023-04-04 11:05:36

Carbon black Thermal Graphite Sheet TIR610-06 with High Thermal Conductive -200℃ ～300℃
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Carbon black Thermal Graphite Sheet TIR610-06 with High Thermal Conductive -200 300 The TIR610-06 Series products are high-performance and heat-conductive interface materials with the reasonable prices. They ... Read More

2023-05-08 16:54:47

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