High Frequency Microprocessors 0.95 W/mK Thermal changing materials Low Resistance -25℃ - 125℃

High Frequency Microprocessors Thermal Interface Pad Low Resistance -25℃ - 125℃

  The TIC™800P Series is low melting point thermal interface material. At 50℃, The TIC™800P Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™800P Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.

     The TIC™800P Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures. 

Features:

>  0.024℃-in² /W thermal resistance
>  Naturally tacky at room temperature, no adhesive required             
>  No heat sink preheating required 

Applications:
>  High Frequency Microprocessors
>  Notebook and Desktop PCs
>  Computer Serves
>  Memory Modules
>  Cache Chips
>  IGBTs

Standard Thicknesses:

0.003"(0.076mm)          0.005"(0.127mm)          0.008"(0.203mm)          0.010"(0.254mm)                  
Consult the factory alternate thickness.

Standard Sizes:

9" x 18"(228mm x 457mm)      9" x 400'(228mm x 121M)              
TIC™800 series are supplied with a white release paper and a bottom liner. TIC™800 series is available in kiss cut an extended pull tab liner or individual die cut shapes.

Peressure Sensitive Adhesive: 

Peressure Sensitive Adhesive is not applicable for TIC™800 series products.

Reinforcement: 

No reinforcement is necessary.