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Products Name: | Cpu Thermal Pad 4.0W/MK With 45 Shore 00 Hardness For RDRAM Memory Modules | Thermal Conductivity: | 4.0W/m-K |
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Hardness: | 45±5 Shore 00 | Operating Temp: | -40-160℃ |
Keywords: | Cpu Thermal Pad | Specific Gravity: | 3.28 G/cc |
Dielectric Constant(@ 1MHz): | 4.75 | Flame Rating: | 94-V0 |
Sample: | Sample Free | Application: | Gpu RDRAM Memory Modules |
Highlight: | thermal conductive material,cpu thermal pad,Cpu thermal conductive adhesive pads |
Cpu Thermal Pad 4.0W/MK With 45 Shore 00 Hardness For RDRAM Memory Modules
The TIF100-40-11S Series is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
Features:
> Good thermal conductive: 4.0W/mK
> Outstanding thermal performance
> Broad range of hardnesses available
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness
Applications:
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> CPU
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
Typical Properties of TIF®100-40-11S Series | ||
Color | Gray | Visual |
Construction | Ceramic filled silicone elastomer | ****** |
Thickness Range(inch/mm) | 0.020~0.20inch(0.5mm~5.0mm) | ASTM D374 |
Density(g/cc) | 3.28 g/cc | ASTM D792 |
Hardness | 45±5 Shore 00 | ASTM 2240 |
Recommended Operating Temperature(℃) | -40 to 160℃ | ****** |
Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 |
Dielectric Constant @ 1MHz | 4.75 | ASTM D150 |
Volume Resistivity | ≥1.0X1012 Ohm-meter | ASTM D257 |
Flame rating | 94-V-0 | UL94(E331100) |
Thermal conductivity | 4.0 W/m-K | ASTM D5470 |
Company profile
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
Our services
Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).
Well-trained & experienced staff are to answer all your inquiries in English of course.
Standard Export Carton Or Marked With Customer's Information Or Customized.
Provide free samples
After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.
we will help you to deal with it and give you satisfactory solution.
Contact Person: Dana Dai
Tel: 18153789196