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Heat Transfer Thermal Interface Materials Thermal Conductive Silicone Thermal Gap Filler Pad For PCB

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The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

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I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

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Heat Transfer Thermal Interface Materials Thermal Conductive Silicone Thermal Gap Filler Pad For PCB

Large Image : Heat Transfer Thermal Interface Materials Thermal Conductive Silicone Thermal Gap Filler Pad For PCB

Product Details:

Place of Origin:	China
Brand Name:	ZIITEK
Certification:	UL and RoHs
Model Number:	TIF500-20-11U

Payment & Shipping Terms:

Minimum Order Quantity:	1000pcs
Price:	Negotiation
Packaging Details:	1000pcs/bag
Delivery Time:	3-5 days
Payment Terms:	T/T
Supply Ability:	100000pcs/day

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Detailed Product Description

Features:	Ultra Soft And Highly Conformable	Product Name:	Heat Transfer Thermal Interface Materials Thermal Conductive Silicone Thermal Gap Filler Pad For Pcb
Keywords:	Thermal Gap Filler Pad	Thickness:	0.010"(0.25mm)~0.200"(5.00mm)
Hardness:	27Shore 00	Application:	LED PCB
Fire Rating:	94-V0	Thermal Conductivity:	2.0W/m-K
Color:	Dark Gray
Highlight:	Heat Transfer Thermal Pad , Thermal Conductive Thermal Interface Materials , Thermal Gap Filler Pad

Heat Transfer Thermal Interface Materials Thermal Conductive Silicone Thermal Gap Filler Pad For PCB

The TIF^®500-20-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision assemblies, such as large tolerances, uneven surfaces, and the susceptibility of delicate components to mechanical damage.

Features:

> Good thermal conductive
> Moldability for complex parts
> Soft and compressible for low stress applications
> Broad range of hardnesses available
> Moldability for complex parts
> Outstanding thermal performance

Applications:

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU

Typical Properties of TIF^®500-20-11U Series
Property	Value		Test method
Color	Dark Gray		Visual
Construction & Compostion	Ceramic filled silicone elastomer		******
Density(g/cm³)	2.5		ASTM D792
Thickness Range(inch/mm)	0.010~0.020	0.030~0.200	ASTM D374
	(0.25~0.50)	(0.75~5.0)
Hardness	65 Shore 00	27 Shore 00	ASTM 2240
Recommended Operating Temperature	-40 to 200℃		******
Breakdown Voltage(V/mm)	≥5500		ASTM D149
Dielectric Constant	4.5 MHz		ASTM D150
Volume Resistivity	＞1.0X10¹² Ohm-meter		ASTM D257
Flame rating	V-0		UL94 (E331100)
Thermal conductivity	2.0 W/m-K		ASTM D5470
	2.0 W/m-K		ISO22007

Product Specifications
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X 16" (406 mm×406 mm)

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF^® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Packaging Details & Lead time

The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated

Company profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

Independent R&D team

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.

Tag:

thermal conductive material,

thermally conductive pad,

cpu thermal pad

Contact Details

Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: 18153789196

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