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China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

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Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

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Good Cushion Spong Gasket 35 Shore A Hardness For Heat Dissipation

Good Cushion Spong Gasket For Heat Dissipation Z-Foam7000W series are more than 100 compounds in EVA/PE foam series, and each compound has its own relevant physical properties. Due to the wide spectrum of ... Read More
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High Temperature Resistant Spong Gasket For Heat Dissipation

High Temperature Resistant Spong Gasket For Heat Dissipation Z-Foam7000W series are more than 100 compounds in EVA/PE foam series, and each compound has its own relevant physical properties. Due to the wide ... Read More
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Foam Sticker EVA and EPE Foam Sponge Materials with Adhesive Tape

High Quality Foam Sticker EVA and EPE Foam Sponge Materials with Adhesive Tape Z-FOAM7000B series product is a kind of polyurethane foam, which has many advantages: low density, soft texture, good dimensional ... Read More
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Cooling Thermal Conductive Silicone Gap Pad Filler For Laptop

Cooling Thermal Conductive Silicone Gap Pad Filler for Laptop Ziitek TIF7100Q is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material ... Read More
2024-08-05 14:28:40
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Low Thermal Resistance 1.6W/mK Phase Change sheet For Electronic Components The TIC80OK Series products is a high thermal conduction and dielectric performance insulator pad consisting of a ceramic filled low ... Read More
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Phase Change Pad Low Thermal Resistance Phase Change Material

Phase Change Pad Low Thermal Resistance Phase Change Material TIC805P series is low melting point thermal interface material.At 50, TIC800P series begins to soften and flow, filling the microscopic irregulariti... Read More
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1.2W Thermal Pad Silicone Laptop High Cooling Thermal Heating Pads for Chipset Battery Factory Thermal Pad Die Cuts The TIF100-12-05ES series thermally conductive interface materials are gap fillers reinforced ... Read More
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