logo
English
Home ProductsThermal Conductive Pad

1.2W Thermal Pad Silicone Laptop High Cooling Thermal Heating Pads for Chipset Battery Factory Thermal Pad Die Cuts

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

I'm Online Chat Now

1.2W Thermal Pad Silicone Laptop High Cooling Thermal Heating Pads for Chipset Battery Factory Thermal Pad Die Cuts

1.2W Thermal Pad Silicone Laptop High Cooling Thermal Heating Pads for Chipset Battery Factory Thermal Pad Die Cuts
1.2W Thermal Pad Silicone Laptop High Cooling Thermal Heating Pads for Chipset Battery Factory Thermal Pad Die Cuts
video play

Large Image :  1.2W Thermal Pad Silicone Laptop High Cooling Thermal Heating Pads for Chipset Battery Factory Thermal Pad Die Cuts

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF100-12-05ES
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5 days
Supply Ability: 100000pcs/day
Detailed Product Description
Products Name: 1.2W Thermal Pad Silicone Laptop High Cooling Thermal Heating Pads For Chipset Battery Factory Thermal Pad Die Cuts Materials: Ceramic Filled Silicone Rubber
Thermal Conductivity: 1.2 W/m-K Hardness: 12±5 Shore 00
Density(g/cm³): 2.0 G/cm³ Dielectric Constant: 4.5 MHz
Fire Rating: 94-V0 Operating Temp: -40~160℃
Keywords: Thermal Heating Pads
Highlight:

1.2W Thermal Pad

,

Laptop Thermal Pad

,

High Cooling Thermal Pad

1.2W Thermal Pad Silicone Laptop High Cooling Thermal Heating Pads for Chipset Battery Factory Thermal Pad Die Cuts
 
The TIF100-12-05ES series thermally conductive interface materials are gap fillers reinforced one side with kepton; the other side with adhesive.They are applied to fill the air gaps between the heating elements and the heatdissipation fins or the metal base.Their flexibility and viscoelastic feature make them ideal to coat very uneven surfaces. lts smooth, puncture-,tear-, wear-resistant reinforcement surface is perfect for reworking and plug-in devices.

 

TIF100-12-05ES-Series-Datasheet.pdf


Features:
>  Good thermal conductive: 1.2 W/mK 
>  Naturally tacky needing no further
>  Soft and Compressible for low stress applications
>  Available in varies thickness

 

1.2W Thermal Pad Silicone Laptop High Cooling Thermal Heating Pads for Chipset Battery Factory Thermal Pad Die Cuts 0


Applications:
>  CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices

 

Typical Properties of TIF100-12-05ES Series
Color Blue Visual
Construction &Compostion Ceramic filled silicone rubber ***
Thickness 0.020"(0.5mm)~0.200"(5.0MM) ASTM D374
Specific Gravity 2.0g/cc ASTM D792
Hardness 12±5 Shore 00 ASTM 2240
Continuos Use Temp -40 to 160℃ ***
Dielectric Breakdown Voltage >5500 VAC ASTM D149
Dielectric Constant 4.5 MHz ASTM D150
Volume Resistivity 1.0X10¹² Ohm-meter ASTM D257
Fire rating 94 V0 UL E331100
Thermal conductivity 1.2 W/m-K ASTM D5470

 

Standard Thicknesses:           
0.010" (0.25mm),0.020" (0.51mm),0.030" (0.76mm),0.040" (1.02mm),0.050" (1.27mm),
0.060" (1.52mm),0.070" (1.78mm),0.080" (2.03mm),0.090" (2.29mm),0.100" (2.54mm),
0.110" (2.79mm),0.120" (3.05mm),0.130" (3.30mm),0.140" (3.56mm),0.150" (3.81mm),
0.160" (4.06mm),0.170" (4.32mm),0.180" (4.57mm),0.190" (4.83mm),0.200" (5.08mm)
Consult the factory alternate thickness.

Standard Sheets Sizes:         
8" x 16"(203mm x 406mm)   16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied. 

Peressure Sensitive Adhesive:                     
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:                     
TIF™ series sheets type can add with fiberglass reinforced.
 
1.2W Thermal Pad Silicone Laptop High Cooling Thermal Heating Pads for Chipset Battery Factory Thermal Pad Die Cuts 1
 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 
 
Company profile
 
Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.
 
1.2W Thermal Pad Silicone Laptop High Cooling Thermal Heating Pads for Chipset Battery Factory Thermal Pad Die Cuts 2
FAQ:
 

Q:How can we get detailed price list?
A:Please offer us detailed information of the product such as Size(length,width,thickness),color,specific packaging requirements and purchasing quantity.
 
Q: What kind of packaging you offer?
A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.
 
Q:Do big buyers have promotional prices?
A: Yes, if you are a big buyer in a certain area, Ziitek will provide you with promotional prices, which will help you start your business here. Buyers with long-term cooperation will have better prices.

 

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer
6.Quality assurance contract

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)