|
Product Details:
Payment & Shipping Terms:
|
Name: | Cooling Thermal Conductive Silicone Gap Pad Filler For Laptop | Applications: | CPU PC GPU |
---|---|---|---|
Material: | Ceramic Filled Silicone Elastomer | Certification: | UL |
Thermal Conductivity: | 8.0W/m-K | Thickness: | 2.5mmT |
Keyword: | Thermal Gap Pad | ||
Highlight: | Silicone Gap Pad Filler,Laptop Thermal Conductive Silicone Gap Pad,Cooling Thermal Conductive Silicone Gap Pad |
Cooling Thermal Conductive Silicone Gap Pad Filler for Laptop
Ziitek TIF7100Q is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF7100Q is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.
Features
> Good thermal conductive: 8.0 W/mK
> Thickness: 2.5 mmT
> hardness:60±10
> Colour: gray
> Easy release construction
> Electrically isolating
> High durability
Applications
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components
Typical Properties of TIF7100Q Series
|
||||
Color
|
Blue |
Visual
|
Composite Thickness
|
Thermal Impedance@10psi
(℃-in²/W) |
Construction &
Compostion |
Ceramic filled silicone elastomer
|
***
|
10mils / 0.254 mm
|
0.16
|
20mils / 0.508 mm
|
0.20
|
|||
Specific gravity |
3.55 g/cc |
ASTM D297
|
30mils / 0.762 mm
|
0.31
|
40mils / 1.016 mm
|
0.36
|
|||
Thickness |
2.5mmT |
***
|
50mils / 1.270 mm
|
0.42
|
60mils / 1.524 mm
|
0.48
|
|||
Hardness
|
60±10 |
ASTM 2240
|
70mils / 1.778 mm
|
0.53
|
80mils / 2.032 mm
|
0.63
|
|||
Thermal conductivity |
8.0W/mk |
ASTMD5470
|
90mils / 2.286 mm
|
0.73
|
100mils / 2.540 mm
|
0.81
|
|||
Continuos Use Temp
|
-40 to 160℃
|
***
|
110mils / 2.794 mm
|
0.86
|
120mils / 3.048 mm
|
0.93
|
|||
Dielectric Breakdown Voltage
|
≥5500 VAC
|
ASTM D149
|
130mils / 3.302mm
|
1.00
|
140mils /3.556 mm
|
1.08
|
|||
Dielectric Constant
|
4.5MHz |
ASTM D150
|
150mils / 3.810 mm
|
1.13
|
160mils / 4.064 mm
|
1.20
|
|||
Volume Resistivity
|
≥ 5.2X1012
Ohm-cm |
ASTM D257
|
170mils / 4.318 mm
|
1.24
|
180mils / 4.572 mm
|
1.32
|
|||
Fire rating(no.E331100)
|
94-V0
|
equivalent
UL |
190mils / 4.826 mm
|
1.41
|
200mils / 5.080 mm
|
1.52
|
|||
Thermal conductivity
|
8.0 W/m-K |
GB-T32064
|
Visua l/ ASTM D751
|
ASTM D5470
|
Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
FAQ
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: How to find a right thermal conductivity for my applications
A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.
Q: Do you accept custom orders ?
A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .
Contact Person: Dana Dai
Tel: 18153789196