Low Thermal Resistance 1.6W/mK Phase Change sheet For Electronic Components
The TIC80OK Series products is a high thermal conduction and dielectric performance insulator pad consisting of a ceramic filled low melting point compound coated on MT Kapton film.
TIC800K-Serice-Datasheet(E)-REV01 (1).pdf
At 50℃,TIC800K Series surface begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.
Features
> Highly compliant surfacecharacteristic with highthermal conductivity.
> High thermal conductive andHigh dielectric strength.
> Low thermal resistance with high voltage isolation
> Resistant to tears and punctures.
Applications
| High Frequency Microprocessors |
| Notebook |
| Computer Serves |
| Memory Modules |
| Cache Chips |
| IGBTs |
| COB Led |
| Desktop PCs |
| CPU |
| Microprocessors |
| Chipsets |
| Graphic Processing Chips |
| Custom application |
| Servers |
| Memory Modules |
| Power semiconductors |
| Power conversion modules |
| LED Power Supply |
| LED Controller |
| LED Lights |
| LED Ceilinglamp |
| Monitoring the Power Box |
| AD-DC Power Adapters |
| Typical Properties of TIC™800K series |
| Product Name |
TIC™805K |
TIC™806K |
TIC™808K |
Test Method |
| Color |
Light Amber |
Visual |
| Composite Thickness |
0.004"/0.102mm |
0.005"/0.127mm |
0.006"/0.152mm |
ASTM D374 |
| MT Kapton ® Thickness |
0.001"/0.025mm |
0.001"/0.025mm |
0.002"/0.050mm |
ASTM D374 |
| Total Thickness |
0.005"/0.127mm |
0.006"/0.152mm |
0.008"/0.203mm |
ASTM D374 |
| Specific Gravity |
2.0 g/cc |
ASTM D297 |
| Heat Capacity |
1 l/g-K |
ASTM C351 |
| Tensile Strength |
>13.5 Kpsi |
>13.5 Kpsi |
>17.8 Kpsi |
ASTM D412 |
| Continuous Use Temp |
(-58 to 266℉) / (-50 to 130℃) |
*** |
| Dielectric Breakdown Voltage |
>4000 VAC |
>5000 VAC |
>6000 VAC |
ASTM D149 |
| Dielectric Constant |
1.8 MHz |
ASTM D150 |
| Volume Resistivity |
3.5X10 |
ASTM D257 |
| 14Ohm-meter |
| Flame Rating |
94 V0 |
equivalent UL |
| Thermal conductivity |
1.6 W/mK |
| Thermal Impedance@50psi |
0.12℃-in²/W |
0.16℃-in²/W |
0.21℃-in²/W |
ASTM D5470 |
Standard Thicknesses:
0.005"(0.127mm) ,0.006"(0.152mm), 0.008"(0.203mm)
Individual die cut shapesand and custom thickness can be supplied. Please contact us for confirming.
Standard Sizes :
10" x 100(254mm x 30.48M) Individual die cut shapes can be supplied.
Peressure Sensitive Adhesive :
Peressure Sensitive Adhesive is not applicable for TICTM800K series products.
Reinforcement:
TICTM800K series sheets are Kapton reinforced.
Factory profile
Manufacturer of standard and custom thermally conductive pads for electric vehicles, autopilot systems, mobile phones, CPUs, motherboards, LCD-TV, telecom devices, and wireless hubs. Features vary depending upon model, including low thermal resistance, high thermal conductivity, and non-deforming. Silicone and non-silicone thermal pads are also offered. Available with operating temperature up to 180 degrees C. Serves the information, communications, telecommunications, consumer electronics, lighting, medical, and energy industries. RoHS and REACH compliant.
FAQ:
Q: Do you offer free samples ?
A: Yes, we are willing to offer free sample.
Q: What is your terms of payment ?
A: Payment<=2000USD, T/T in advance. Paying in time and faithful for several months, we can apply other payment term for you, pay together in every month or 30 days.
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