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Durable Thermal Adhesive Tape For Mounting Heat Sinks On BGA Chips And Power Converter PCBs With Strong Bond Strength

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China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
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Durable Thermal Adhesive Tape For Mounting Heat Sinks On BGA Chips And Power Converter PCBs With Strong Bond Strength

Durable Thermal Adhesive Tape For Mounting Heat Sinks On BGA Chips And Power Converter PCBs With Strong Bond Strength
Durable Thermal Adhesive Tape For Mounting Heat Sinks On BGA Chips And Power Converter PCBs With Strong Bond Strength Durable Thermal Adhesive Tape For Mounting Heat Sinks On BGA Chips And Power Converter PCBs With Strong Bond Strength Durable Thermal Adhesive Tape For Mounting Heat Sinks On BGA Chips And Power Converter PCBs With Strong Bond Strength

Large Image :  Durable Thermal Adhesive Tape For Mounting Heat Sinks On BGA Chips And Power Converter PCBs With Strong Bond Strength

Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: RoHs
Model Number: TIA800AL
Document: TIA800AL_Data Sheet.pdf
Payment & Shipping Terms:
Minimum Order Quantity: 10SQM
Price: Negotiation
Packaging Details: 10RL/bag
Delivery Time: 3-7Work days
Payment Terms: T/T
Supply Ability: 1000SQM/Day

Durable Thermal Adhesive Tape For Mounting Heat Sinks On BGA Chips And Power Converter PCBs With Strong Bond Strength

Description
Prodcuts Name: Durable Thermal Adhesive Tape For Mounting Heat Sinks On BGA Chips And Power Converter PCBs With Strong Bond Strength Backing Type: Aluminum Foil
Adhesive Type: Acrylic Adhesive Recommanded Operating Temperature(℃): -40~125
180°Peel Adhesion (gf/inch) Steel,Immediate: ≥1200 Thermal Conductivity: 1.6 W/mK
Keywords: Durable Thermal Adhesive Tape Thickness: 0.006"/0.15mm
Application: Mounting Heat Sinks On BGA Chips And Power Converter PCBs
Highlight:

adhesive foam tape

,

acrylic adhesive tape

,

Aluminum Thermal Adhesive Tape

Durable Thermal Adhesive Tape For Mounting Heat Sinks On BGA Chips And Power Converter PCBs With Strong Bond Strength


The TIA®800AL Series is widely used for bonding heat sinks to microprocessors and other power consuming semiconductors. These tapes have strong adhesive strength and good thermal conductivity, aiming to replace traditional mechanical fixation and thermal conductive silicone grease,simplify assembly processes,improve product reliability,and are an ideal choice for solving the heat dissipation challenges of modern compact electronic devices.

Features

>High bonding strength
>Good thermal conductivity efficiency
>Easy to apply and can be die-cut into custom sizes
>Stable operation over a wide temperature range

Applications

> Mount heat sink onto BGA graphic processor or drive processor
>Aluminum Foil Thermally Conductive Acrylic Adhesive For Mount Heat Spreader Onto Power Converter PCBor onto motor control PCB
> High performance, thermally conductive acrylic adhesive 
> Can be used instead of heat cure adhesive,screw mounting or clip mounting

Typical Properties of  TIA®806AL Series
Products Name TIA®806AL TIA®806AL TIA®806AL Test Method
Color White
Visual
Adhesive Type Acrylic Adhesive
-
Backing Type Aluminum Foil
-
Recommanded Operating Temperature(℃) -40~125
-
Thickness (inch/mm) 0.006/ 0.15 0.008/0.20 0.010/0.25 ASTM D374
Breakdown Voltage(V) ≥ 1000 ≥ 1200 ≥ 1500 ASTM D149
Thermal Conductivity (W/mK) 1.6
ASTM D5470
180°Peel Adhesion (gf/inch) Steel, Immediate ≥ 1200
ASTM D149
180°Peel Adhesion (gf/inch) Steel, 24hrs ≥ 1400
JIS K02378
Holding Power (H/inch) @25℃ ≥ 48
JIS K023711
Holding Power (H/inch) @80℃ ≥ 48
JIS K023711
 
Product Specifications

Standard Thickness:0.006"(0.15 mm),0.008"(0.20 mm),0.010" (0.25 mm)
Standard Size: 16"×100" (406 mmx 30.48 m)
Reinforcing Carrier:TIAB80oAL Series rolls can be reinforced with aluminum foil

The TIA Series can be provided with die-cutting into various shapes.
For different thicknesses or more information about thermally conductive materials,please contact our company.

Durable Thermal Adhesive Tape For Mounting Heat Sinks On BGA Chips And Power Converter PCBs With Strong Bond Strength

 
Durable Thermal Adhesive Tape For Mounting Heat Sinks On BGA Chips And Power Converter PCBs With Strong Bond Strength
Company Profile
 
Dongguan Ziitek Electronic Material and Technology Ltd. is a professional manufacturer of thermal interface materials with many years of industry experience. Integrating R&D, production, sales, and technical services, the company offers a comprehensive product line covering thermally conductive silicone pads, thermal conductive grease/paste,thermally conductive graphite sheets, phase change materials, thermally conductive plastics, thermal gel , silicone foam, silicone-free thermal pads etc.We adhere to strict quality standards and provide customized solutions based on customer requirements. Our products are widely used in electronics, new energy, telecommunications, industrial control, and other fields, earning the trust of customers both domestically and internationally through our proven capabilities.
 

Our services

Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)