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Two-Component High Thermal Conductivity Epoxy Resin Glue Compound For Electronic Components Encapsulation

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
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I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

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Two-Component High Thermal Conductivity Epoxy Resin Glue Compound For Electronic Components Encapsulation

Two-Component High Thermal Conductivity Epoxy Resin Glue Compound For Electronic Components Encapsulation
Two-Component High Thermal Conductivity Epoxy Resin Glue Compound For Electronic Components Encapsulation Two-Component High Thermal Conductivity Epoxy Resin Glue Compound For Electronic Components Encapsulation

Large Image :  Two-Component High Thermal Conductivity Epoxy Resin Glue Compound For Electronic Components Encapsulation

Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: RoHs
Model Number: TIE280-12AB
Payment & Shipping Terms:
Minimum Order Quantity: 2KG/LOT
Packaging Details: 1kg/can
Delivery Time: 2-3 work days
Detailed Product Description
Color: Balck Specific Gravity: 1.6 G/cc
Viscosity@25℃ Brookfield: 7000 CPs Hardness @25℃: 85 Shore D
Dielectric Breakdown Voltage: 300 Volts / Mi Thermal Conductivity: 1.2W/m-K
Keywords: Epoxy Resin Glue Compound
Highlight:

heat conductive glue

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Conductive Adhesive Glue 0.3W / mK

Two-Component High Thermal Conductivity Epoxy Resin Glue Compound For Electronic Components Encapsulation

 

 

TIETM280-12AB Series is a two-component, high thermal conductive, low temperature cured, long pot life, fire resistant Silica encapsulant glue. lt is design for potting of capacitors and electrical devices.Their flexibility and elasticity make them suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

 

TIE280-12AB-Series-Datasheet (2).pdf

 

Two-Component High Thermal Conductivity Epoxy Resin Glue Compound For Electronic Components Encapsulation 0

Features

 

>  Good thermal conductive: 1.2W/mK
>  Excellent insulation and smoothly sourface.
>  Low shrinkage
>  Low viscosity, expediting air releaseed.
>  Excellent in solvents and water proof. 
>  Longer life time.
>  Excellent thermal shock efficiecy and impact resistance

 

Application  

 

>To potting LED Lighting heat spreader and power- driver.
>Ferrite cements; tip type LED; good cementation to aromatic polyester

>Relay sealant; Good adhesion to rubber, ceramics,PCB and plastics

>Power transformers and coils; Potting capacitors; Potting of small electrical devices
>Adhesion to metal glass and plastic;LCD & substrates adhesion; Coating and sealant; Coil ; IGBTS;Transformer; Fire retardant
>Optical / medical component adhesive

 

 

 

Typical Properties of TIETM280-12AB Series
Typical Uncured Material
TIETM280-12A(Resin) Mixing ratio (weight ratio)
A:=1 :1
Color Black
Viscosity @25℃ Brookfield 15000 cPs Viscosity @25℃ Brookfield 10000 cPs
Operating time (@25℃) 45 mins
Shelf life @25℃ in sealed 12 months specific Gravity 1.6 g/cc
Mixture Color Black
TIE280-12B(Hardener) Cure Schedule
Color Black Cure at 25C 3 hrs
Viscosity @25℃ Brookfield 7000 cPs
Shelf life @25℃ in sealed container 12 months Cure at 7o°c 30 mins
Cured Properties
Hardness @25℃ 85 Shore D
Operating temperature -40℃ ~160℃
Glass transition temperature Tg 92℃
Rate of tension 0.10%
Coefficient of thermal expansion, /℃ 3.0x 10^(-5)
Fire resistance UL 94 V-0
Moisture absorption % wt gain 24 hours water immersion @25℃ <0.1%
Thermal Conductivity 1.2 W/m-K
Dielectric Breakdown Voltage 300 volts / mil
Dielectric Constant@1MHz 4.2
volume resistivity, ohm-cm @ 25℃ 3.0x 10^13

 

 Product packaging:

 

1KG A/B for each tank.

5KG A/B each.

10KG A/B each.

 

Company profile

 

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

 

Two-Component High Thermal Conductivity Epoxy Resin Glue Compound For Electronic Components Encapsulation 1

 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

 

 

 

 

 

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Miss. Dana

Tel: 18153789196

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